隨著科技日新月異的發展，以及電子產品市場需求的激增，工業4.0時代已然來臨，設備之間的資訊交換與協作，無疑變得更加重要且不可或缺。本研究運用MIAT方法論，設計系統的整體架構，建構系統的IDEF0功能模組，並針對每一個功能模組，均進行了離散事件的模型建構，創建出了Grafcet模型，最終完成軟體的高階合成。本研究基於SEMI SMT-ELS A1/A1.1協定規範，主要開發SEMI SMT-ELS A2中所提及的主機與設備間，以及設備與設備間的水平通訊功能應用。透過實現連線狀態管理、MD參考模式管理、生產線路線規格管理以及MD傳送等四大核心功能，降低了企業的人力成本支出，同時也提升生產效率，為企業在激烈競爭的市場環境中，贏得更強大的競爭實力。有賴於標準化的通訊協定以及智慧化的管理功能，該軟體大幅降低人工逐一設定各設備的繁瑣工作，顯著優化整體生產流程，為企業節省大量人力成本開支。本研究成果可以幫助企業應對工業4.0帶來的嚴峻挑戰，還幫助SMT製程促進標準化統一，對於提升印刷電路板生產效率及品質控制，實具重大意義，是推動印刷電路板行業實現升級轉型重要的驅動力。;With the rapid development of technology and the increasing demand in the electronic product market, the era of Industry 4.0 has arrived. The exchange and collaboration of information between equipment have become increasingly important and indispensable. This study employs the MIAT methodology to design the overall system architecture, construct the IDEF0 functional modules of the system, and develop discrete event models for each functional module, creating Grafcet models, ultimately achieving the high-level synthesis of the software. Based on the SEMI SMT-ELS A1/A1.1 protocol specifications, this study primarily focuses on developing the horizontal communication functions between hosts and equipment as outlined in SEMI SMT-ELS A2, as well as the communication functions between equipment. By implementing core functions such as connection status management, MD reference mode management, production line route specification management, and MD transmission, the system reduces the enterprise′s labor costs and improves production efficiency. This enables companies to gain a stronger competitive edge in the fiercely competitive market environment. Thanks to standardized communication protocols and intelligent management functions, the software significantly reduces the tedious work of manually setting up each device, optimizes the overall production process, and saves a significant amount of labor costs for the enterprise. The research results can help companies address the challenges brought by Industry 4.0 and promote standardization and unity in the Surface Mount Technology (SMT) process. This is of great significance for improving the efficiency of printed circuit board production and quality control, serving as a key driver in advancing the upgrade and transformation of the printed circuit board industry.
