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    "Kao,CR"的相关文件  

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    类别 日期 题名 作者 档案
    [化學工程與材料工程研究所] 期刊論文 2009 Special Issue: 2009 Pb-Free Solders - Foreword Kang,SK; Anderson,I; Chada,S; Duh,JG; Turbini,LJ; Wu,A; Kao,CR; Hua,F; Subramanian,KN; Frear,D; Handwerker,C; Guo,F; Chawla,N; Zeng,KJ
    [化學工程與材料工程研究所] 期刊論文 2005 Controlling the microstructures from the gold-tin reaction Tsai,JY; Chang,CW; Shieh,YC; Hu,YC; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2005 Electromigration induced metal dissolution in flip-chip solder joints Lin,YH; Tsai,CM; Hu,YC; Lin,YL; Tsai,JY; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2005 Electromigration-induced failure in flip-chip solder joints Lin,YH; Tsai,CM; Hu,YC; Lin,YL; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2005 Electromigration-induced grain rotation in anisotropic conducting beta tin Wu,AT; Gusak,AM; Tu,KN; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2004 Cross-interaction of under-bump metallurgy and surface finish in flip-chip solder joints Tsai,CM; Luo,WC; Chang,CW; Shieh,YC; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2004 Effects of the gold thickness of the surface finish on the interfacial reactions in flip-chip solder joints Lin,YL; Luo,WC; Lin,YH; Ho,CE; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2004 Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction Wu,AT; Tu,KN; Lloyd,JR; Tamura,N; Valek,BC; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2004 Special issue on Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials III - Foreword Kao,CR; Chen,SW; Lee,HM; Mohney,SE; Notis,MR; Swenson,DJ
    [化學工程與材料工程研究所] 期刊論文 2003 A study on the reaction between cu and Sn3.5Ag solder doped with small amounts of Ni Tsai,JY; Hu,YC; Tsai,CM; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2003 Chemical reaction in solder joints of microelectronic packages Ho,CE; Lin,YL; Tsai,JY; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2003 Electromigration failure in flip chip solder joints due to rapid dissolution of copper Hu,YC; Lin,YH; Kao,CR; Tu,KN
    [化學工程與材料工程研究所] 期刊論文 2003 Recent progress in phase diagram calculation and application Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2003 Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword Lucas,JP; Chada,S; Kang,SK; Kao,CR; Lin,KL; Ready,J; Yu,J
    [化學工程與材料工程研究所] 期刊論文 2003 Special issue on phase stability, phase transformations, and reactive phase formation in electronic materials - Foreword Chen,SW; Lee,HM; Swenson,D; Kao,CR; Mohney,SE; Notis,MR; Schmid-Fetzer,R
    [化學工程與材料工程研究所] 期刊論文 2002 Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders Chen,WT; Ho,CE; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni Ho,CE; Tsai,RY; Lin,YL; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Inhibiting the formation of (Au1-xNix)Sn-4 and reducing the consumption of Ni metallization in solder joints Ho,CE; Shiau,LC; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Phase diagrams of important electronic materials Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages Shiau,LC; Ho,CE; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2002 Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni Ho,CE; Lin,YL; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2001 Interactions between solder and metallization during long-term aging of advanced microelectronic packages Ho,CE; Chen,WT; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2001 Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering Ho,CE; Tsai,SY; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2001 Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish Liu,CM; Ho,CE; Chen,WT; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2001 Selective interfacial reaction between Ni and eutectic BiSn lead-free solder Tao,WH; Chen,C; Ho,CE; Chen,WT; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2001 Special issue on lead-free solder materials and soldering technologies - Foreword Kang,SK; Mavoori,H; Chada,S; Kao,CR; Smith,RW
    [化學工程與材料工程研究所] 期刊論文 2000 Formation and resettlement of (AuxNi1-x)Sn-4 in solder joints of ball-grid-array packages with the Au/Ni surface finish Ho,CE; Zheng,R; Luo,GL; Lin,AH; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2000 Long-term aging study on the solid-state reaction between 58Bi42Sn solder and Ni substrate Chen,C; Ho,CE; Lin,AH; Luo,GL; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 2000 Optimizing the wire-bonding parameters for second bonds in ball grid array packages Ho,CE; Chen,C; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1999 Binary compounds in the Ge-Ti system Jain,TA; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1999 Formation and absence of intermetallic compounds during solid-state reactions in the Ni-Bi system Lee,MS; Chen,C; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1999 Interfacial reactions between Ni substrate and the component Bi in solders Lee,MS; Liu,CM; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1999 Phase relation in the titanium-rich region of the Ge-Si-Ti ternary system Jain,TA; Huang,CG; Ho,CE; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1999 Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering Ho,CE; Chen,YM; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1999 Schottky enhancement of contacts to n-GaAs via the exchange mechanism using NiAlxGa1-x as a metallization Chen,CP; Lin,CF; Swenson,D; Kao,CR; Jan,CH; Chang,YA
    [化學工程與材料工程研究所] 期刊論文 1998 Phase equilibria of the Si-Ge-Ti system relevant to the reactions between SiGe alloys and Ti Jain,TA; Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1997 Calculation of low-temperature phase equilibria in the indium-lead system Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1997 Microstructures developed in solid-liquid reactions: using Cu-Sn reaction, Ni-Bi reaction, and Cu-In reaction as examples Kao,CR
    [化學工程與材料工程研究所] 期刊論文 1997 Reactions of solid copper with pure liquid tin and liquid tin saturated with copper Hayashi,A; Kao,CR; Chang,YA
    [化學工程與材料工程研究所] 期刊論文 1996 A mechanism for reactive diffusion between Si single crystal and NbC powder compact Kao,CR; Woodford,J; Chang,YA
    [化學工程與材料工程研究所] 期刊論文 1996 On the relationships between the self-diffusion parameters and the thermodynamic properties in B2 intermetallic compounds Kao,CR
    [材料科學與工程研究所 ] 期刊論文 2005 In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing Lin,YH; Hu,YC; Tsai,CM; Kao,CR; Tu,KN
    [材料科學與工程研究所 ] 期刊論文 2005 Solid-state reactions between Ni and Sn-Ag-Cu solders with different Cu concentrations Luo,WC; Ho,CE; Tsai,JY; Lin,YL; Kao,CR

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