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    Items for Author "Lin,JC" 

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    Showing 66 items.

    Collection Date Title Authors Bitstream
    [機械工程研究所] 期刊論文 1994 EFFECT OF CHROMATE ION ON ZINC ELECTROWINNING FROM ACID SULFATE ELECTROLYTE LIN,JC; TSAI,SL
    [機械工程研究所] 期刊論文 1994 ELECTROCHEMICAL STRIPPING OF GOLD FROM AU-NI-CU ELECTRONIC CONNECTOR SCRAP IN AN AQUEOUS-SOLUTION OF THIOUREA LIN,JC; HUARNG,JJ
    [機械工程研究所] 期刊論文 1994 SYNTHESIS, CHARACTERIZATION AND DYNAMICAL NMR-STUDIES OF MESO-TETRA (4-PYRIDYL)PORPHYRINATOTHALLIUM(III) ACETATE - TL(TPYP)(OAC) FUH,JJ; TANG,SS; LIN,YH; CHEN,JH; LIU,TS; WANG,SS; LIN,JC
    [機械工程研究所] 期刊論文 1995 ON THE SINTERING OF MIXED AND ALLOYED SILVER-PALLADIUM POWDERS FROM CHEMICAL COPRECIPITATION LIN,JC; WU,W
    [機械工程研究所] 期刊論文 1996 Assessment of polyester and polyvinylester coatings in a simulated FGD scrubbing liquid with EIS Lin,JC; Lue,LY; Chyou,SD; Horng,HN
    [機械工程研究所] 期刊論文 1996 Effect of surface properties of silver powder on the sintering of its thick-film conductor Lin,JC; Wang,CY
    [機械工程研究所] 期刊論文 1996 Effects of surfactant treatment of silver powder on the rheology of its thick-film paste Lin,JC; Wang,CY
    [機械工程研究所] 期刊論文 1996 On the resistance of silver migration in Ag-Pd conductive thick films under humid environment and applied dc field Lin,JC; Chan,JY
    [機械工程研究所] 期刊論文 1996 Selective dissolution of the cobalt binder from scraps of cemented tungsten carbide in acids containing additives Lin,JC; Lin,JY; Jou,SP
    [機械工程研究所] 期刊論文 1996 Synthesis and characterization of phosphorus complexes of meso-tetraphenylporphyrin (tpp), and X-ray crystal structure of [P(tpp)(OCH(CH3)(2))(2)](+)Cl- Cheng,PC; Liu,IC; Hong,TN; Chen,JH; Wang,SS; Wang,SL; Lin,JC
    [機械工程研究所] 期刊論文 1997 Resistance to silver electrolytic migration for thick-film conductors prepared from mixed and alloyed powders of Ag-15Pd and Ag-30Pd Lin,JC; Chuang,JY
    [化學研究所] 期刊論文 1997 Hydrogen chemisorption and thermal desorption on the diamond C(111) surface Su,C; Song,KJ; Wang,YL; Lu,HL; Chuang,TJ; Lin,JC
    [機械工程研究所] 期刊論文 1998 Effect of pre-aging on precipitation hardening in Al-Si-Mg alloys Lee,SL; Tan,YH; Yie,SN; Lin,JC
    [機械工程研究所] 期刊論文 1998 Effects of Be addition on microstructures and mechanical properties of B319.0 alloys Wamg,PS; Liauh,YJ; Lee,SL; Lin,JC
    [機械工程研究所] 期刊論文 1999 Corrosion inhibition of steel by thiourea and cations under incomplete cathodic protection in a 3.5% NaCl solution and seawater Lin,JC; Chang,SL; Lee,SL
    [機械工程研究所] 期刊論文 1999 Effects of SiCp reinforcement by electroless copper plating on properties of Cu/SiCp composites Lee,YF; Lee,SL; Chuang,CL; Lin,JC
    [機械工程研究所] 期刊論文 1999 Mechanical properties of Al-11%Si casting alloys containing trace Be and Sr Yie,SN; Lee,SL; Lin,YH; Lin,JC
    [機械工程研究所] 期刊論文 1999 The properties of Zn-Ni electrodeposition on aluminium alloys Wang,PS; Liang,MR; Lee,SL; Lin,JC
    [機械工程研究所] 期刊論文 1999 Wear and corrosion behaviors of SiCp reinforced copper matrix composite formed by hot pressing Lee,YF; Lee,SL; Lin,JC
    [機械工程研究所] 期刊論文 2000 Effects of Fe content on microstructure and mechanical properties of A206 alloy Tseng,CJ; Lee,SL; Wu,TF; Lin,JC
    [機械工程研究所] 期刊論文 2000 Effects of solution temperature on mechanical properties of 319.0 aluminum casting alloys containing trace beryllium Wang,PS; Lee,SL; Lin,JC; Jahn,MT
    [資訊工程研究所] 期刊論文 2000 A new LDA-based face recognition system which can solve the small sample size problem Chen,LF; Liao,HYM; Ko,MT; Lin,JC; Yu,GJ
    [機械工程研究所] 期刊論文 2002 Effects of Si-p size and volume fraction on properties of Al/Si-p composites Chien,CW; Lee,SL; Lin,JC; Jahn,MT
    [機械工程研究所] 期刊論文 2002 Solid-liquid interdiffusion bonding between In-coated silver thick films Lin,JC; Huang,LW; Jang,GY; Lee,SL
    [機械工程研究所] 期刊論文 2003 Electroplating of copper onto a preanodized 7005Al/Al2O3(P) metal matrix composite Lin,JC; Jehng,WD; Lee,SL
    [機械工程研究所] 期刊論文 2003 Processing and properties of high volume fraction aluminium/silicon composites Chien,CW; Lee,SL; Lin,JC
    [機械工程研究所] 期刊論文 2004 Effect of beryllium and non-equilibrium heat treatment on mechanical properties of B319.0 alloy with 1 center dot 0%Fe Wang,PS; Lee,SL; Yang,CY; Lin,JC
    [機械工程研究所] 期刊論文 2004 Effects of graphite on wear and corrosion behaviour of SiCp-reinforced copper matrix composites formed by hot pressing Wu,TF; Qiu,ZW; Lee,SL; Lee,ZG; Lin,JC
    [材料科學與工程研究所 ] 期刊論文 2005 Effect of Ag content and heat treatment on the stress corrosion cracking of Al-4.6Cu-0.3Mg alloy Chang,CH; Lee,SL; Lin,JC; Yeh,MS; Jeng,RR
    [材料科學與工程研究所 ] 期刊論文 2005 Effects of Be and Fe on the mechanical and corrosion behaviors of A357 alloys Yang,CY; Lee,SL; Lee,CK; Lin,JC
    [材料科學與工程研究所 ] 期刊論文 2005 Effects of lead and copper particles on corrosion and wear behaviour of Al-Si matrix composites Chuang,SF; Wu,TF; Lee,SL; Kao,CH; Lin,JC; Lee,ZK
    [材料科學與工程研究所 ] 期刊論文 2005 The effect of silver content on the precipitation of the Al-4.6Cu-0.3Mg alloy Chang,CH; Lee,SL; Lin,JC; Jeng,RR
    [機械工程研究所] 期刊論文 2005 Concentration effect of HF on energy band diagram for n-Si(100)/HF photoelectrochemical etching system Jehng,WD; Lin,JC; Lee,SL
    [機械工程研究所] 期刊論文 2005 Effects of tungsten carbide and cobalt particles on corrosion and wear behaviour of copper matrix composite Wu,TF; Lee,SL; Chen,MH; Li,ZG; Lin,JC
    [機械工程研究所] 期刊論文 2005 Energy band diagrams for the photo-electrochemical dissolution of n-Si(100) in HF Jehng,WD; Lin,JC; Lai,CM; Lee,SL
    [機械工程研究所] 期刊論文 2005 Separation of gallium and arsenic in wafer grinding extraction solution using a supported liquid membrane that contains PC88A as a carrier Tsai,CY; Chen,YF; Chen,WC; Yang,FR; Chen,JH; Lin,JC
    [光機電工程研究所 ] 期刊論文 2005 Fabrication of micrometer Ni columns by continuous and intermittent microanode guided electroplating Lin,JC; Jang,SB; Lee,DL; Chen,CC; Yeh,PC; Chang,TK; Yang,JH
    [通訊工程研究所] 期刊論文 2007 A frequency offset estimation technique based on CCK for a WLAN receiver design Hsu,HY; Lin,JC
    [通訊工程研究所] 期刊論文 2007 A frequency offset estimation technique based on frequency error characterization for OFDM communications on multipath fading channels Lin,JC
    [資訊工程研究所] 期刊論文 2008 Ratio-based time synchronization protocol in wireless sensor networks Sheu,JP; Hu,WK; Lin,JC
    [化學工程與材料工程研究所] 期刊論文 2009 Corrosion behavior of Al, Sc-co-doped ZnO thin films in 3.5% NaCl solution Lin,JC; Peng,KC; Peng,IG; Lee,SL
    [化學工程與材料工程研究所] 期刊論文 2009 Effect of pre-immersion on the SCC of heat-treated AA7050 in an alkaline 3.5%NaCl Liao,HL; Lin,JC; Lee,SL
    [化學工程與材料工程研究所] 期刊論文 2009 Influence of hot-pressing temperature on the performance of PEMFC and catalytic activity Lin,JC; Lai,CM; Ting,FP; Chyou,SD; Hsueh,KL
    [化學工程與材料工程研究所] 期刊論文 2009 On the structure and characterization of Al, Sc-co-doped ZnO-films varying with 0-2.37 wt.% Sc contents Lin,JC; Peng,KC; Yeh,TY; Lee,SL
    [機械工程研究所] 期刊論文 2009 Effect of trace La addition on the microstructures and mechanical properties of A356 (Al-7Si-0.35Mg) aluminum alloys Tsai,YC; Chou,CY; Lee,SL; Lin,CK; Lin,JC; Lim,SW
    [機械工程研究所] 期刊論文 2009 Fabrication of a micrometer Ni-Cu alloy column coupled with a Cu micro-column for thermal measurement Lin,JC; Chang,TK; Yang,JH; Jeng,JH; Lee,DL; Jiang,SB
    [機械工程研究所] 期刊論文 2009 Localized Ni deposition improved by saccharin sodium in the intermittent MAGE process Yang,JH; Lin,JC; Chang,TK; You,XB; Jiang,SB
    [機械工程研究所] 期刊論文 2009 On the characterization of Al-0.11 wt.%Sc alloy thin film Liao,HL; Lin,JC; Chen,YS; Chuang,CL; Lee,SL
    [機械工程研究所] 期刊論文 2009 On the oxygen reduction reaction catalyzed by Ti-Cu binary films in 0.5 M sulfuric acid solution Lin,JC; Chuang,CL; Lai,CM; Chu,HC; Chen,YS
    [機械工程研究所] 期刊論文 2009 On the structure of micrometer copper features fabricated by intermittent micro-anode guided electroplating Lin,JC; Yang,JH; Chang,TK; Jiang,SB
    [通訊工程研究所] 期刊論文 2009 Channel estimation assisted by postfixed pseudo-noise sequences padded with zero samples for mobile orthogonal-frequency-division-multiplexing communications Lin,JC
    [通訊工程研究所] 期刊論文 2009 Least-squares channel estimation assisted by self-interference cancellation for mobile pseudo-random-postfix orthogonal-frequency-division multiplexing applications Lin,JC
    [材料科學與工程研究所 ] 期刊論文 2010 Localized electrochemical deposition of micrometer copper columns by pulse plating Lin,JC; Chang,TK; Yang,JH; Chen,YS; Chuang,CL
    [機械工程學系] 期刊論文 2010 Effect of annealing on morphology, optical reflectivity, and stress state of Al-(0.19-0.53) wt.% Sc thin films prepared by magnetron sputtering Lin,JC; Liao,HL; Jehng,WD; Tseng,CA; Shen,JJ; Lee,SL
    [機械工程學系] 期刊論文 2010 Effect of Spinning Deformation Processing on the Wear and Corrosion Properties of Al-7Si-0.3Mg Alloys Cheng,YC; Lin,CK; Tan,AH; Lin,JC; Lee,SL
    [機械工程學系] 期刊論文 2010 Effects of Cu content on microstructure and mechanical properties of Al-14.5Si-0.5Mg alloy Wu,CT; Lee,SL; Hsieh,MH; Lin,JC
    [機械工程學系] 期刊論文 2010 Effects of Mg Content on Microstructure and Mechanical Properties of Al-14.5Si-4.5Cu Alloy Wu,CT; Lee,SL; Hsieh,MH; Lin,JC
    [機械工程學系] 期刊論文 2010 Study on Injection Molding Parameters for Thin-Shell Plastic Parts Using a Neural Network-Based Approach Lin,JC; Yang,YK; Hsiao,YH; Jeng,MC
    [機械工程學系] 期刊論文 2010 The Development of a Real-Time Image Guided Micro Electroplating System Chen,TC; Hwang,YR; Lin,JC; Ciou,YJ
    [資訊工程學系] 期刊論文 2010 Distributed Localization Scheme for Mobile Sensor Networks Sheu,JP; Hu,WK; Lin,JC
    [材料科學與工程研究所 ] 期刊論文 2011 Corrosion characteristics of nickel, copper, and stainless steel in a Lewis neutral chloroalurninate ionic liquid Lin,PC; Sun,IW; Chang,JK; Su,CJ; Lin,JC
    [材料科學與工程研究所 ] 期刊論文 2011 Development of new type Ni-Mg texture-like structure hydrogen absorber Hsu,CW; Lee,SL; Hsu,FK; Lin,JC
    [材料科學與工程研究所 ] 期刊論文 2011 Influence of Mg(3)AlNi(2) content on the cycling stability of Mg(2)Ni-Mg(3)AlNi(2) hydrogen storage alloy electrodes Lee,SL; Hsu,FK; Chen,WC; Lin,CK; Lin,JC
    [機械工程學系] 期刊論文 2011 Effect of Solvent on the Morphology of Nickel Localized Electrochemical Deposition Chen,YS; Lin,JC; Lin,ZH; Li,C; Chang,JK
    [機械工程學系] 期刊論文 2011 Enhancement of ECDM efficiency and accuracy by spherical tool electrode Yang,CK; Wu,KL; Hung,JC; Lee,SM; Lin,JC; Yan,BH
    [機械工程學系] 期刊論文 2011 Mechanical Properties of Copper Micrometer Pillars Fabricated by Intermittent MAGE Process Lin,JC; Chen,YS; Huang,CF; Yang,JH; Chang,TK; Wu,CL; Hwang,YR; Chen,TC

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