參考文獻 |
1. R. Heming, L. C. wittig, P. Dannberg, J. Jahns, E. B. Kley, and M.Gruber, “Efficient planar-integrated free-space optical interconnects fabricated by a combination of binary and analog lithography,” IEEE J. Lightwave Technol., 26, 2136-2141 (2008).
2. P. Lukowicz et al., “Optoelectronic interconnection technologyin the HOLMS system,” IEEE J. Sel. Top. Quantum Electron., 9, 624-635 (2003). 3. H. L. Althaus, W. Gramann, and K. Panzer, “Microsystems and wafer processesfor volume production of highly reliable fiber
optic components for telecom- anddatacom-application,” IEEE Trans. on Compon., Packag., and Manufact. Technol. pt. B, 21, 147-156 (1998).
4. B. S. Rho, S. H. Hwang, J. W. Lim, G. W. Kim, C. H. Cho, and W.-J. Lee, “Intra-system optical interconnection module directly integrated on a polymeric optical waveguide,” OPTICS EXPRESS, 17, 1215-1221(2009).
5. F. E. Doany, C. L. Schow, C. W. Baks, D. M. Kuchta, P.
Pepeljugoski, L. Schares, R. Budd, F. Libsch, R. Dangel, F.
Horst, B. J. Offrein, and J. A. Kash, “160 Gb/s bidirectional polymer-waveguide board-Level optical interconnects using CMOS-based rransceivers,” IEEE Transactions on Advanced Packaging, 32, 345-359 (2009).
6. S. Hiramatsu and T. Mikawa, “Optical design of active
interposer for high-speed chip level optical interconnects,” J. of Lightwave Technol., 24, 927-934 (2006).
7. I. Connor, F. Tissafi-Drissi, F. Gaffiot, J. Dambre, M. De Wilde, J. Van Campenhout, D. Van Thourhout, J. Van Campenhout, and D. Stroobandt, “Systematic simulation-based predictive synthesis of integrated optical interconnect,” IEEE Trans. on VLSI Sys., 15, 927-940 (2007).
8. B. Analui, D. Guckenberger, D. Kucharski, and A. Narasimha, “A fully integrated 20-Gb/s optoelectronic transceiver implemented in a standard 0.13-um CMOS SOI technology,” IEEE J. Solid-state Circuit., 41, 2945-2955 (2006).
9. J. Lousteau, D. Furniss, A. B. Seddon, T. M. Benson, A.
Vukovic, and P. Sewell, “The single-mode condition for
silicon-on-insulator optical rib waveguides with large cross section,” J. of Lightwave Technol., 22, 1923-1929 (2004).
10. M. M. Miloševic´, P. S. Matavulj, P. Y. Yang, A. Bagolini, and G. Z. Mashanovich, “Rib waveguides for mid-infrared silicon photonics,” J. Opt. Soc. Am. B, 26, 1760-1766 (2009).
11. Y. Wang, Z. Lin, C. Zhang, F. Gao, and F. Zhang, “Integrated SOI rib waveguide using inductively coupled plasma reactive ion etching,” IEEE J. of Selected Topics in Quantum Electronics, 11, 254-259 (2005).
12. K. K. Lee, D. R. Lim, and L. C. Kimerling,“Fabrication of ultralow-loss SiSiO2 waveguides by roughness reduction,” Optics Letters, 26, 1888-1890 (2001).
13. R. Halir, A. Ortega-moñux, J. O. Wangüemert-pérez, I.
Molina-fernández, and P. Cheben, “Fabrication tolerance
analysis of bent single-mode rib waveguides on SOI,” Optical and Quantum Electronics, 921-932 (2007).
14. R. P. Boye, and R. K. Kostuk, “Investigation of the effect if finite grating size on the performance of guided-mode resonance filters,” Appl. Opt., 39, 3649 (2000).
15. G. B. Hocker, and W. K. Burns, “Mode dispersion in diffused channel waveguides by the effective index method,” Applied Optics, 16, 113-118 (1977)
16. H. C. Lan, H. L. Hsiao, C. C. Chang, C. H. Hsu, C. M. Wang, M. L. Wu,“Monolithic integration of elliptic-symmetry diffractive optical element on silicon-based 45° micro-reflector,” Opt. Express, 17, 20938-20944 (2009).
17. B. E. Lemoff, M. E. Ali, G. Panotopoulos, G. M. Flower, B. Mahdavan, A. F. J.Levi, and D. W. Dolfi, “MAUI: Enabling fiber-to-processor with parallel multiwavelength optical 59 interconnects,” IEEE J. Lightwave Technol., 22, 2043-2054 (2004).
18. F. Wang, F. Liu, and A. Adibi, “45 degree polymer micromirror integration for board-level three-dimensional optical interconnects,” Opt. Express, 17, 10514-10521 (2009).
19. 張育誠, “微型光學讀取頭之元件,” (中央大學光電所碩士
論文, 台灣, 2003)
20. I. Zubel, “Silicon anisotropic etching in alkaline solutions III: On the possibility of spatial structures forming in the course of Si(100) anisotropic etching in KOH and KOH+IPA solutions,” Sensors and Actuators A: Physical, 84, p. 116-125 (2000)
21. I. Zubel, “Silicon anisotropic etching in alkaline solutions IV – The effect of organic and inorganic agents on silicon nisotropic etching process,” Sensors and Actuators A: Physical, 87, p. 163-171 (2001)
22. I. Zubel, “The effect of isopropyl alcohol on etching rate and roughness of (100) Si surface etched in KOH and TMAH solutions,” Sensors and Actuators A: Physical, 93, p. 138-147 (2001)
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