鑲入鎳-鑽石顆粒複合鍍層的竹碳工具之研發及其研磨加工特性研究

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莊英鍠(Ying-Huang Zhuang) 查詢紙本館藏

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機械工程學系

論文名稱

鑲入鎳-鑽石顆粒複合鍍層的竹碳工具之研發及其研磨加工特性研究
(Inserts into the Ni - Diamond Particles of Bamboo Carbon Composite of Coating Tools and Grinding Characteristics of Research and Development)

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摘要(中)

本研究為製作一種竹碳複合電鍍研磨工具，對矽晶圓試片進行研磨拋光，其利用竹碳具有導電性以及結構中含有複數個中空維管束，將鎳-鑽石電鍍液利用吸取式，輸入竹碳維管束內部進行複合電鍍，現今產業上有許多價格昂貴、高精密、製作不易之材料，因此越來越注重對於材料在加工或使用上的有效利用、管理以及保護。竹碳材料有導電性、脆性以及內部具有中空管束，可利用複合電鍍法將磨料鍍於中空管束內，製成竹碳研磨工具。
竹碳研磨工具，在加工過程中，無需外加研磨料，竹碳在加工接觸面上會自行剝落而產生新的研磨粒持續對工件表面進行加工，形成內部補給研磨粒的機制，既節省設備、時間、磨料，又可得到良好的加工品質。
本研究成功利用吸取式配合適當之複合電鍍參數，製作出不同鑽石含量的竹碳複合電鍍研磨工具，能夠在竹碳上複合電鍍上豐富的研磨顆粒，鎳-鑽石複合鍍層重量為71.46mg、由EDS 分析得知鎳-鑽石複合鍍層中鑽石研磨顆粒含量為89.8wt%。
在研究結果中得知雖然在電流0.05A、時間10min、濃度10wt%可得到
較高的鑽石研磨顆粒含量，但在研磨實驗中結果卻不理想，反而是電流0.05A、時間3min、濃度1wt%時，所製作出之較低含量鑽石研磨顆粒之竹碳工具，加工後表面粗糙度Ra 0.026μm、改善率為89.71%，證明在製作竹碳工具，只需要較短的時間以及較低的濃度，就可有效降低表面粗糙度將試片加工至鏡面，無疑大幅的降低了成本。

摘要(英)

In this study, production of a bamboo carbon composite plating grinding tools, the test piece for the silicon wafer polishing, the use of electrically conductive bamboo carbon structure containing a plurality of hollow vascular bundle, the Ni - plating bath using the diamond draw type,
input within the composite vascular bundle of bamboo carbon plating.
There are many industries today are expensive, high precision, making the material difficult, so more and more emphasis on the material in the processing or the use of effective use, management and protection. Bamboo
conductive carbon material, brittle and hollow tubes, composite plating method can be used in the hollow tubes coated abrasives, the grinding tools made of bamboo carbon.
In the process, Bamboo carbon grinding tools, no external abrasive, in the processing of bamboo carbon contact surface will generate a new self-peeling and grinding grain for processing continuous on the surface to form a supply of abrasive particles within the self-sharpening mechanism, both to save equipment, time, abrasive, but also get good processing quality.
In this study, successful use of draw-style composite plating with appropriate parameters to produce different levels of bamboo carbon composite diamond plated grinding tools, bamboo carbon composite abrasive particles plated on the rich, composite coating weight 71.46mg, diamond abrasive particle content of 89.8wt%.Although the study results that the current 0.05A, time 10min, receive a higher concentration of 10wt% diamond abrasive particle content, but the results of the experiment in the ground is not ideal, but the current 0.05A, time of 3min, the concentration of 1wt% when produced by a low content of abrasive particles of bamboo carbon diamond tools, surface roughness after processing Ra 0.026μm, improved rate of 89.71%, that tool in the production of bamboo carbon, only a short time and low concentrations, can effectively reduce the surface roughness of the specimen to mirror
processing, dramatically reducing costs.

關鍵字(中)

★ 竹碳
★ 維管束
★ 複合電鍍
★ 拋光
★ 矽晶圓

關鍵字(英)

★ Bamboo charcoal
★ porosities
★ polishing
★ wafer
★ co-deposition

論文目次

目錄
摘要 ………………………………………………………………………...i
Abstract ……………………………………………………………………...ii
謝誌 ………………………………………………………………………...iv
目錄…………………………………………………………………………..v
圖目錄 …………………………………………………………………….viii
表目錄 ……………………………………………………………………..xii
第一章緒論…………………………………………………………………..1
1-1 研究背景 ........................................................................................ 1
1-2 研究動機與目的 ............................................................................. 4
1-3 文獻回顧 ........................................................................................ 5
1-3-1 複合電鍍 .............................................................................. 5
1-3-2 晶圓拋光 .............................................................................. 6
1-4 研究架構 ........................................................................................ 7
第二章基本原理與介紹…………………………………………………….9
2-1 竹碳 ................................................................................................ 9
2-1-1 竹碳簡介 ................................................................................ 9
2-1-2 竹碳之製程 ......................................................................... 10
2-1-3 竹碳特性與應用 .................................................................. 11
2-1-4 竹碳結構 ............................................................................. 15
2-2 複合電鍍原理 ............................................................................... 17
2-3 矽晶圓特性介紹 ........................................................................... 20
2-5 機械拋光機制 ................................................................................ 24
2-6 二體與三體接觸滑動 ................................................................... 26
第三章實驗設備、機構與流程 ...............................................................29
3-1 實驗相關設備 ............................................................................... 29
3-2 實驗材料 ....................................................................................... 33
3-2-1 氨基磺酸鎳鍍液 ................................................................. 33
3-2-2 鑽石磨料 .............................................................................. 34
3-2-3 矽晶圓試片 .......................................................................... 35
3-3 實驗機構 ...................................................................................... 35
3-3-1 竹碳複合電鍍機構與加工方法 ........................................... 35
3-3-2 竹碳研磨機構與加工方法 .................................................. 38
3-3-3 竹碳試片製作 ..................................................................... 41
3-4 實驗參數設定 ............................................................................... 42
3-4-1 竹碳複合電鍍實驗設定 ....................................................... 42
3-4-2 竹碳研磨工具拋光實驗設定 .............................................. 44
3-4-3 實驗流程 ..............................................................................46
第四章結果與討論 ...................................................................................48
4-1 製程參數對竹碳複合電鍍後重量之影響 ..................................... 48
4-1-1 電流參數對竹碳複合電鍍磨粒附著之影響 ....................... 48
4-1-2 濃度參數對竹碳複合電鍍磨粒附著之影響 ....................... 53
4-1-3 時間參數對竹碳複合電鍍磨粒附著之影響 ....................... 58
4-2 複合電鍍製程參數對竹碳工具之拋光特性影響 ........................ 62
4-2-1 製程電流對竹碳工具加工之影響 ...................................... 62
4-2-2 製程濃度對竹碳工具加工之影響 ...................................... 67
4-2-3 製程時間對竹碳工具加工之影響 ...................................... 72
4-3 竹碳複合電鍍研磨材之研磨參數影響探討 ................................. 76
4-3-1 無施加搖擺 ......................................................................... 76
4-3-1-1 拋光研磨盤轉速對表面粗糙度之影響 ................... 76
4-3-1-2 馬達轉速對表面粗糙度之影響 ............................. 80
4-3-1-3 試片表面形貌觀察 ................................................. 83
4-3-2 施加搖擺 .............................................................................. 87
4-3-2-1 加工時間對表面粗糙度之影響 ............................. 87
4-3-2-2 拋光研磨盤轉速對表面粗糙度之影響 .................. 91
4-3-2-3 馬達轉速對表面粗糙度之影響 ............................. 94
4-3-2-4 試片表面形貌觀察 ………………………….…….97
第五章總結論……………………………………………………………102
參考文獻 .………………………………………………………………...104

參考文獻

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指導教授

顏炳華(Biing-Hwa Yan)

審核日期

2011-7-14

推文