白光LED之封裝效率之研究

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姓名

李惇儒(Dun-Ru Li) 查詢紙本館藏

畢業系所

光電科學與工程學系

論文名稱

白光LED之封裝效率之研究
(The study of package efficiency for white LEDs)

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摘要(中)

本論文中，我們將研究不同白光LED封裝型式其封裝效率之差異，利用已建構之YAG螢光粉模型在相同色溫下，分析六種封裝型式在封裝效率上的差異，並討論其封裝效率差異的原因，再探討改變基板反射率與晶片吸收等參數對封裝效率的變化。
接著以實際封裝驗證六種封裝之效率，首先量測得到基板反射率，接著實際進行六種封裝方式，最後分析比較六種封裝其實驗及模擬的差異。

摘要(英)

In this thesis, we study the package loss for six white LED package types. Based on the YAG phosphor model, we build up six white LED package types in our simulation. Under the same CCT, we calculate package loss between six different packages and analyze the effect of the different LED package types. We also discuss the influence of the package loss by changing the reflectivity of the substrate and the absorption coefficient of the die.
In order to verify the simulation data, we try to do the experiments for investigation of the package loss of the six LED package types. First, We measure the reflectivity of substrate, then we do the six geometry of LEDs package. Finally, we compare with simulation and experimental data and analyze the difference between simulation and experiment.

關鍵字(中)

★ 螢光粉
★ 封裝效率
★ 白光LED

關鍵字(英)

★ phosphor
★ white LED
★ package efficiency

論文目次

目錄
摘要 ........................................................................................................................ i
Abstract ................................................................................................................. ii
致謝 ...................................................................................................................... iii
目錄 ....................................................................................................................... v
圖目錄 ................................................................................................................ viii
表目錄 ................................................................................................................ xiii
第一章緒論 ...................................................................................................... 1
1.1 LED 背景 ............................................................................................. 1
1.2 研究動機與目的 .................................................................................. 3
1.3 論文大綱 .............................................................................................. 5
第二章基本原理 .............................................................................................. 7
2.1 引言 ...................................................................................................... 7
2.2 LED 發光原理 ..................................................................................... 7
2.3 螢光粉原理 .......................................................................................... 8
vi
2.4 封裝技術 ............................................................................................ 11
第三章不同封裝型式之封裝效率分析 ........................................................ 16
3.1 引言 .................................................................................................... 16
3.2 螢光粉模型 ........................................................................................ 16
3.2.1 遮蔽程度 ................................................................................. 18
3.2.2 吸收及轉換參數 ..................................................................... 20
3.2.3 螢光粉模型驗證與分析 ......................................................... 22
3.3 封裝效率之定義 ................................................................................ 25
3.4 封裝效率之分析 ................................................................................ 27
3.4.1 封裝架構之建立 ..................................................................... 28
3.4.2 封裝效率之分析 ..................................................................... 29
第四章實驗結果與模擬分析之比較 ............................................................ 50
4.1 引言 .................................................................................................... 50
4.2 反射率量測實驗 ................................................................................ 50
4.3 實際封裝實驗 .................................................................................... 54
vii
4.3.1 晶片出光之計算 ..................................................................... 54
4.3.2 封裝架構之驗證 ..................................................................... 57
第五章結論 .................................................................................................... 68
參考文獻 ............................................................................................................. 70
中英文名詞對照表 ............................................................................................. 73

參考文獻

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指導教授

孫慶成(Ching-Cherng Sun)

審核日期

2011-7-24

推文