博碩士論文 995201027 詳細資訊




以作者查詢圖書館館藏 以作者查詢臺灣博碩士 以作者查詢全國書目 勘誤回報 、線上人數:102 、訪客IP:18.118.16.91
姓名 李家儀(Chia-Yi Lee)  查詢紙本館藏   畢業系所 電機工程學系
論文名稱 提升聚焦離子束對訊號探測能力之細部繞線方法
(Detailed Routing for FIB Probing)
相關論文
★ 三維積體電路的微凸塊分配與晶粒間繞線之研究★ 考慮製造限制之繞線研究
★ 使用次序關係配置三維積體電路微凸塊★ 考慮線長匹配的平行匯流排之逃脫繞線
★ 用於三維積體電路之溫度導向平面規劃的散熱型矽晶穿孔面積融合方法★ 雙圖案微影技術下考慮原生衝突之電路軌道繞線
★ 考量障礙物間通道寬度限制及避免電子遷移效應的繞線樹建構之研究★ 三維積體電路中同步降低熱點溫度與電源雜訊之研究
★ 使用延遲決策技術於類比電路之可繞度導向擺置方法★ 考慮障礙物閃避及電荷分享之鑽孔數量最小化跳線插入演算法
★ 模組化層級三維積體電路之矽晶穿孔規劃與線長最佳化★ 降低不匹配效應之力導向電容擺置方法
★ 考慮繞線資源需求之標準元件擺置合法化★ Simultaneous escape routing for mixed-pattern signals on staggered pin arrays
★ 面積與最大線長最佳化之類比積體電路 佈局產生器★ 含多重檢查機制之實體驗證自動化工具
檔案 [Endnote RIS 格式]    [Bibtex 格式]    [相關文章]   [文章引用]   [完整記錄]   [館藏目錄]   [檢視]  [下載]
  1. 本電子論文使用權限為同意立即開放。
  2. 已達開放權限電子全文僅授權使用者為學術研究之目的,進行個人非營利性質之檢索、閱讀、列印。
  3. 請遵守中華民國著作權法之相關規定,切勿任意重製、散佈、改作、轉貼、播送,以免觸法。

摘要(中) 在製造晶片的過程中,電路佈局可能因為微塵粒子或是設計錯誤的影響
而導致晶片運作結果與預期不同。若修正設計後再重新執行設計流程,將延
後產品上市時間。因此,聚焦離子束(Focused Ion Beam, FIB) 技術被用來
矽後除錯與直接修正電路佈局,替代重複的設計流程,使產品上市時間不受
影響。
隨著製程的演進,積體電路元件尺寸逐漸縮小,電路繞線密度也隨之提
升。但是,聚焦離子束的技術卻無法跟上製程的演進,導致先進製程的電路
難以利用聚焦離子束進行探測或電路編輯,嚴重限制電路的測試與除錯。實
施聚焦離子束程序時所影響的範圍,遠大於先進製程的線寬與線距,若繞線
密度過高,在實施聚焦離子束程序時將影響到多條鄰近的訊號線。以90奈米
製程的電路為例,只有百分之三十的訊號線有足夠的空間可以實施聚焦離子
束程序。
本研究旨在細部繞線階段提升聚焦離子束能見度。我們提出繞線格點上
的三種聚焦離子束狀態(仰視狀態、俯視狀態和環視狀態) 及其代價,並修
改迷宮繞線之波傳遞方法,使得每條訊號線找到一條有足夠空間可以實施聚
焦離子束程序的最短路徑。實驗結果顯示,我們所提出的方法可以達到百分
之百的可繞度,並且將可以實施聚焦離子束程序的訊號線數量最大化。
摘要(英) In the process of manufacturing a chip, a circuit layout which is affected
by particles or design errors may cause that the chip operation differs with the
desired one. As a result, post-silicon debug becomes a critical and necessary
step in the current design flow. Therefore, instead of the iterative design
process, focused ion beam (FIB) technology is used to improve the time to
market by directly correcting the circuit layout.
As the manufacturing process evolves, the size of ICs is gradually reduced,
and the wire density of a circuit increases. However, FIB technology cannot
keep up with the evolution of the manufacturing process. Therefore, the FIB
cannot be easily used in probing or circuit editing, incurring the limitations of
testing and debugging. Since the influence of FIB is much larger than the line
spacing and width, the FIB process will affect several adjacent signal lines if
the wire density is too high. For example, only 30% signal lines for a circuit
using the 90-nm process can apply FIB.
The purpose of this thesis is to improve the FIB observable rate in the
detailed routing stage. We propose three FIB states (lookup, lookdown, and
lookpin) with their costs in the routing grid, and modify the wave propagation
stage in the maze routing to find a shortest path which has enough space to
process FIB for each net. Experimental results show that the proposed method
can achieve 100% routability with maximizing the number of signal lines which
can apply FIB.
關鍵字(中) ★ 聚焦離子束
★ 細部繞線
關鍵字(英) ★ detailed routing
★ FIB
★ focused ion beam
論文目次 摘要............................................................................................................................. i
Abstract....................................................................................................................... ii
致謝............................................................................................................................. iii
目錄............................................................................................................................. iv
圖目錄......................................................................................................................... vi
表目錄......................................................................................................................... viii
第一章、緒論.............................................................................................................. 1
1.1 前言............................................................................................................... 1
1.2 背景知識....................................................................................................... 2
1.2.1 聚焦離子束原理................................................................................... 2
1.2.2 聚焦離子束能見度(FIB Observable Rate) .......................................... 4
1.3 研究動機....................................................................................................... 5
1.4 問題描述....................................................................................................... 6
第二章、相關研究....................................................................................................... 7
第三章、聚焦離子束能見度之細部繞線...................................................................... 10
3.1 細部繞線之聚焦離子束違例(FIB Violation) ................................................ 10
3.2 主要想法....................................................................................................... 12
3.3 考慮聚焦離子束能見度之細部繞線流程........................................................ 14
3.4 圖案繞線(Pattern Routing).......................................................................... 15
3.4.1 U形線與U形線的限制條件................................................................... 16
3.4.2 U形線與非U形線的限制條件............................................................... 19
3.4.3 整數線性規劃公式............................................................................... 20
3.5 聚焦離子束導向繞線(FIB-Driven Routing) ................................................. 23
3.5.1 波傳遞修改(Propagation Modification) .............................................. 23
3.5.2 聚焦離子束狀態與代價(FIB State and Cost) ..................................... 26
3.6 可繞性導向繞線(Routability-Driven Routing)............................................. 38
第四章、實驗結果與分析............................................................................................ 40
4.1 工作平台與測試檔說明................................................................................. 40
4.2 實驗結果分析與比較..................................................................................... 40
4.2.1 MCNC測試電路................................................................................... 41
4.2.2 Faraday測試電路................................................................................. 43
第五章、結論與未來展望............................................................................................ 46
參考文獻...................................................................................................................... 48
參考文獻 [1] http://jchen.myweb.hinet.net/fib/index.html.
[2] http://www-01.ibm.com/software/integration/optimization/cplex-optimizer/.
[3] Kuo-An Chen, Tsung-Wei Chang, Meng-Chen Wu, Mango Chia-Tso Chao, Jing-
Yang Jou, and Sonair Chen, “Design-for-debug layout adjustment for FIB probing
and circuit editing,” in Proceedings of IEEE International Test Conference (ITC),
September 2011, pp. 1–9.
[4] Minsik Cho, Yongchan Ban, and David Z. Pan, “Double patterning technology
friendly detailed routing,” in Proceedings of IEEE/ACM International Conference
Computer-Aided Design (ICCAD), November 2008, pp. 506–511.
[5] Minsik Cho, Kun Yuan, Yongchan Ban, and David Z. Pan, “Eliad: Efficient lithography
aware detailed router with compact post-OPC printability prediction,” in Proceedings
of IEEE/ACM Design Automation Conference (DAC), June 2008, pp. 504–
509.
[6] Minsik Cho, Kun Yuan, Yongchan Ban, and David Z. Pan Pan, “Eliad: Efficient
lithography aware detailed routing algorithm with compact and macro post-opc
printability prediction,” IEEE Transactions on Computer-Aided Design of Integrated
Circuits and Systems (TCAD), vol. 28, no. 7, pp. 1006–1016, July 2009.
[7] Jason Cong, Jie Fang, Min Xie, and Yan Zhang, “Mars - a multilevel full-chip gridless
routing system,” IEEE Transactions on Computer-Aided Design of Integrated
Circuits and Systems (TCAD), vol. 24, no. 3, pp. 382–394, March 2005.
[8] Focused Ion Beam Technology, Capabilites and Applications, FEI Company, 2005.
[9] Kai hui Chang, Igor L. Markov, and Valeria Bertacco, “Reap what you sow spare
cells for post-silicon metal fix,” in Proceedings of ACM International Symposium on
Physical Design (ISPD), 2008, pp. 103–110.
[10] Chih-Ta Lin, Yen-Hung Lin, Guan-Chan Su, and Yih-Lang Li, “Dead via minimization
by simultaneous routing and redundant via insertion,” in Proceedings of
IEEE/ACM Asia and South Pacific Design Automation Conference (ASP-DAC),
January 2010, pp. 657–662.
[11] Tahir Malik, Rajesh Jain, Roger Nicholson, and Ted Lundquist, “Role of circuit edit
in post-silicon debug and diagnostics,” in IEEE Silicon Debug & Daignosis, 2005.
[12] Jarrod A. Roy, Saurabh N. Adya, David A. Papa, and Igor L. Markov, “Min-cut
floorplacement,” IEEE Transactions on Computer-Aided Design of Integrated Circuits
and Systems (TCAD), vol. 25, no. 7, pp. 1313–1326, July 2006.
[13] Chad Rue, Circuit Edit Basic, FEI Company, May 2008.
[14] C. G. Talbot, M. Park, N. Richardson, P. Alto, and D. Masnaghetti, “IC modification
with foucused ion beam system,” U.S. Patent NO. 5,140,164, 1992.
[15] Yun-Ru Wu, Shu-Yi Kao, and Shih-Arn Hwang, “Minimizing ECO routing for FIB,”
in Proceedings of IEEE VLSI Design Automation and Test (VLSI-DAT), April 2010,
pp. 351–354.
指導教授 陳泰蓁(Tai-Chen Chen) 審核日期 2012-8-15
推文 facebook   plurk   twitter   funp   google   live   udn   HD   myshare   reddit   netvibes   friend   youpush   delicious   baidu   
網路書籤 Google bookmarks   del.icio.us   hemidemi   myshare   

若有論文相關問題,請聯絡國立中央大學圖書館推廣服務組 TEL:(03)422-7151轉57407,或E-mail聯絡  - 隱私權政策聲明