無鉛熔錫波銲製程實驗之探討

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姓名

賴振同(Cheng-tung Lai) 查詢紙本館藏

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機械工程學系在職專班

論文名稱

無鉛熔錫波銲製程實驗之探討
(Experiments of lead-free wave soldering investigate process)

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摘要(中)

科技的發展開發了具備多功能的新產品，在這些新產品的製造過程中，銲接技術正面臨一波新的挑戰，銲接後接點的品質也受到嚴重之考驗，在銲接技術中，熔錫波銲製程是一個產業常用的方法，在銲接製程中，使用無鉛銲料代替有鉛焊料傾向於修改操作條件，影響熔錫波銲的因素相當多，包含設計不良、板材鑽孔粗糙度、PCB水氣、組件儲存與管控、零件與孔徑設計間隙值、通孔鍍層不均與腳鍍層氧化厚度等問題都可能產生不銲接缺陷，而影響到產品的銲接性能。本論文嘗試利用實驗設計法來探討無鉛熔錫波銲製程之最佳化，希望找出熔錫波銲製程缺陷的主要影響因數，並依研究結果，設計出熔錫波銲製成的最佳參數，以降低銲接之缺陷。例如在PCB孔徑與插件腳間隙值的設計方面，必須在考量縮小插件腳孔尺寸與其所造成之插件難度增加，找出合理之平衡值，製程環境的溼度、溫度控制也必須嚴密控制，才能確保熔錫波銲製程的品質與穩定度。利用實驗設計法預估所得的最佳波銲條件，實際應用波銲實驗顯示出相當吻合之對照結果，因此本實驗設計法相當適合於波銲製程品質管控之改善。

摘要(英)

Abstract
Many innovative products have been manufactured by modern technologies soldering process,acting as a key technology in the manufacturing process faces a new challenges ,since the strick requirement on the quality of solder joint. Among the soldering technologies, wave soldering process is adopted a popular methods in the industy . The use of Pb-Free solders in place of Pb-Sn solders inclined to modify the operational conditions in the soldering process , wave soldering of factors impactis is quite many factors,including improper design,roughness of drilling hole size on the board ,moisture PCB content in the storage components, improper clearance between the size and the aperture of the holes, non-uniform deposit in the through-holes and pins of coated with various thickness of oxides etc,haved been found to affect the performance of soldering. In this dissertation, the author try to investigate the optimization of the lead-free wave soldering process to have been found to means of the technique by design of experiments method. The purpose of this work is to find out the most important factors in the wave soldering process dominating the solder quality .As a result optimal parameters were selected following by using of design of experiments to rule out many possible soldering defect. For examples the clearance at various levels should be set to a blance value between the pin size and the hole size on the board. A greater clearance is necessary a between the pin and hole when a bent pin need to be plugged in the hole, the humidity and temperature of processing environment should be strictly controlled in order to ensure the quality and stability of the solders,there is a good consistent between the experimental result of wave-soldering process performed under the optimal conditions selected by means of design of experiments and the theorectical results predicted according to design of experiments .This consistence implied that design of experiments is an applicable technique suitable for quality control in wave-soldering process.

關鍵字(中)

★ 實驗設計

關鍵字(英)

★ design of experiments

論文目次

中文摘要………………………………………………………………i
英文摘要………………………………………………………………ii
謝誌……………………………………………………………………iii
目錄……………………………………………………………………v
圖目錄…………………………………………………………………viii
表目錄…………………………………………………………………x
符號……………………………………………………………………xi
第一章、簡介
1-1無鉛銲錫材料與熔錫波銲技術之發展………………………01
1-1-1無鉛銲錫材料之發展………………………………… 01
1-1-2熔錫波銲技術………………………………………… 01
1-2研究動機………………………………………………… 05
1-3研究目的………………………………………………… 06
第二章、無鉛熔錫波銲技術原理…………………………………… 08
2-1銲接技術之原理簡介………………………………………… 08
2-2表面黏著技術………………………………………………… 08
2-2-1鋼板開製、錫膏使用與印刷…………………………… 08
2-2-2元件貼著………………………………………………… 11
2-2-3迴銲………………………………………………………12
2-3熔錫波銲原理………………………………………………… 13
2-3-1插件…………………………………………………… 14
2-3-2助銲劑使用………………………………………………16
2-3-3預熱……………………………………………………… 23
2-3-4銲錫……………………………………………………… 24
2-3-5錫槽濃度成份管理 ………………………………………30
2-4熔錫波銲造成之缺陷……………………………………………33
2-5零件與基板線路設計 …………………………………………35
2-6造成熔錫波銲孔缺陷之原因……………………………………38
第三章、實驗設計法 ……………………………………………………45
3-1實驗設計法原理…………………………………………………45
3-2應用文獻 …………………………………………………………46
第四章、實驗方法 ……………………………………………………… 47
4-1實驗設備………………………………………………………… 50
4-2試片製作與觀察………………………………………………… 51
4-3實驗方法………………………………………………………… 53
第五章、結果與討論…………………………………………………… 55
第六章、結論…………………………………………………………… 63
第七章、未來研究方向………………………………………………… 64
參考文獻………………………………………………………………… 65

參考文獻

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指導教授

林景崎(Jing-chie Lin)

審核日期

2013-1-25

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