參考文獻 |
[1] Yoshitaka Taniyasu, and Makoto Kasu, "Improved Emission Efficiency of 210-nm Deep-ultraviolet Aluminum Nitride Light-emitting Diode," NTT Technical Review, 2010.
[2] O. Ambacher, B. Foutz, J. Smart, J. R. Shealy, N. G. Weimann, K. Chu, M. Murphy, A. J. Sierakowski, W. J. Schaff, L. F. Eastman, R. Dimitrov, A. Mitchell, and M. Stutzmann, "Two dimensional electron gases induced by spontaneous and piezoelectric polarization in undoped and doped AlGaN/GaN heterostructures," Journal of Applied Physics, vol. 87, p. 334, 2000.
[3] M. A. Khan, X. Hu, G. Sumin, A. Lunev, J. Yang, R. Gaska, and M. S. Shur, "AlGaN/GaN metal oxide semiconductor heterostructure field effect transistor," IEEE Electron Device Letters, vol. 21, pp. 63-65, 2000.
[4] Tohru Oka, and Tomohiro Nozawa, "AlGaN/GaN Recessed MIS-Gate HFET With High-Threshold-Voltage Normally-Off Operation for Power Electronics Applications," IEEE Electron Device Letters, vol. 29, pp. 668-670, 2008.
[5] Ki-Sik Im, Jong-Bong Ha, Ki-Won Kim, Jong-Sub Lee, Dong-Seok Kim,
Sung-Ho Hahm, and Jung-Hee Lee, "Normally Off GaN MOSFET Based on AlGaN/GaN Heterostructure With Extremely High 2DEG Density Grown on Silicon Substrate," IEEE Electron Device Letters, vol. 31, pp. 192-194, 2010.
[6] Mi-Kyung Kwon, Ki-Won Kim, Sung-Dal Jung, Dong-Seok Kim, Ki-Sik Im, Hee-Sung Kang, Chul-Ho Won, Ryun-Hwi Kim, Kyu-Il Jang and Jung-Hee Lee, "Effect of Al2O3 Gate Insulator Thickness on Characteristics of Normally-off GaN MOSFETs," Journal of Photonic Science and Technology, vol. 2, pp. 25-28, 2012.
[7] Junxia Shi, Lester F. Eastman, Xiaobin Xin, and Milan Pophristic, "High performance AlGaN/GaN power switch with HfO2 insulation," APPLIED PHYSICS LETTERS, vol. 95, p. 042103, 2009.
[8] Liang Pang, Yaguang Lian, Dong-Seok Kim, Jung-Hee Lee, and Kyekyoon Kim, "AlGaN/GaN MOSHEMT With High-Quality Gate–SiO2 Achieved by Room-Temperature Radio Frequency Magnetron Sputtering," IEEE TRANSACTIONS ON ELECTRON DEVICES, vol. 59, pp. 2650-2655, 2012.
[9] Li-Hsien Huang, Shu-Hao Yeh, Ching-Ting Lee, Haipeng Tang, Jennifer Bardwell, and James B. Webb, "AlGaN/GaN Metal–Oxide–Semiconductor
High-Electron Mobility Transistors Using Oxide Insulator Grown by Photoelectrochemical Oxidation Method," IEEE Electron Device Letters, vol. 29, pp. 284-286, 2008.
[10] A.Fontserè, A.Pérez-Tomása, P.Godignona, and J.Millán, "High Voltage Low Ron In-situ SiN/Al0.35GaN0.65/GaN on-Si Power HEMTs Operation up to 300 C," Solid-State Device Research Conference, pp. 306-309, 2012.
[11] Taku Sato, Junich Okayasu, Masahiko Takikawa, and Toshi-kazu Suzuki, "AlGaN-GaN Metal-Insulator-Semiconductor High-Electron-Mobility Transistors With Very High-k Oxynitride TaOxNy Gate Dielectric," IEEE Electron Device Letters, vol. 34, pp. 375-377, 2013
[12] Xinwei Wang, Omair I. Saadat, Bin Xi, Xiabing Lou, Richard J. Molnar, Tomas Palacios, and Roy G. Gordon, "Atomic layer deposition of Sc2O3 for passivating AlGaN/GaN high electron mobility transistor devices," APPLIED
PHYSICS LETTERS, vol. 101, p. 232109, 2012.
[13] A.Fontserèa, A.Pérez-Tomása, V. Banua, P.Godignona, and J.Millán, "A HfO2 based 800V/300oC Au-free AlGaN/GaN-on-Si HEMT Technology," 24th International Symposium on Power Semiconductor Devices and ICs, pp. 37-40, 2012.
[14] Marleen Van Hove, Sanae Boulay, Sandeep R. Bahl, Steve Stoffels, Xuanwu Kang, Dirk Wellekens, Karen Geens, Annelies Delabie, and Stefaan Decoutere, "CMOS Process-Compatible High-Power Low-Leakage AlGaN/GaN MISHEMT on Silicon," IEEE Electron Device Letters, vol. 33, pp. 667-669, 2012.
[15] B. De Jaeger, M. Van Hove, D. Wellekens, X. Kang, H. Liang, G. Mannaert, K. Geens, and S. Decoutere, "Au-free CMOS-compatible AlGaN/GaN HEMT processing on 200 mm Si substrates," 24th International Symposium on Power Semiconductor Devices and ICs, pp. 49-52, 2012.
[16] Oliver Hilt, Eldad Bahat-Treidel, Eunjung Cho, Sebastian Singwald and Joachim Würfl, "Impact of Buffer Composition on the Dynamic On-State Resistance of High-Voltage AlGaN/GaN HFETs," 24th International Symposium on Power Semiconductor Devices and ICs, pp. 345-348, 2012.
[17] Donghyun Jin and Jesús A. del Alamo, "Mechanisms responsible for
dynamic ON-resistance in GaN high-voltage HEMTs," 24th International Symposium on Power Semiconductor Devices and ICs, pp. 333-336, 2012.
[18] K.S. Boutros, S. Burnham, D. Wong, K. Shinohara, B. Hughes, D. Zehnder, and C. McGuire, "Normally-off 5A/1100V GaN-on-Silicon Device for High Voltage Applications," International Electron Devices Meeting(IEDM), pp. 161-16., 2009.
[19] Y. Dora, A. Chakraborty, L. McCarthy, S. Keller, S. P. DenBaars, and U. K. Mishra, "High Breakdown Voltage Achieved on AlGaN/GaN .HEMTs With Integrated Slant Field Plates," IEEE Electron Device Letters, vol. 27, pp. 713-715, 2006.
[20] Silvia Lenci, Xuanwu Kang, Dirk Welleken et al., "Au-free, High-Breakdown AlGaN/GaN MISHEMTs with Low Leakage, High Yield
and Robust TDDB Characteristics," CS MANTECH Conference, 2012.
[21] Injun Hwang, Hyoji Choi, JaeWon Lee et al., "1.6kV, 2.9 mΩ cm2 Normally-off p-GaN HEMT Device," 24th International Symposium on Power Semiconductor Devices and ICs, pp. 41-44, 2012.
[22] Takashi Mizutani, Yutaka Ohno, M. Akita, Shigeru Kishimoto, and
Koichi Maezawa, "A Study on Current Collapse in AlGaN/GaN HEMTs Induced by Bias Stress," IEEE TRANSACTIONS ON ELECTRON DEVICES, vol. 50, pp. 2015-2020, 2003.
[23] Wataru Saito, Tomohiro Nitta, and Yorito Kakiuchi et al., "Suppression of Dynamic On-Resistance Increase and Gate Charge Measurements in High-Voltage GaN-HEMTs With Optimized Field-Plate Structure," IEEE TRANSACTIONS ON ELECTRON DEVICES, vol. 54, pp. 1825-1830.
[24] David Deen, David Storm, David Meyer et al., "AlN/GaN HEMT with high-k ALD HfO2 or Ta2O5 gate insulation," Phys. Status Solidi C 8, No. 7-8, 2420-2423, 2011.
[25] Sen Huang, Qimeng Jiang, Shu Yang, Zhikai Tang, and Kevin J. Chen, "Mechanism of PEALD-Grown AlN Passivation for AlGaN/GaN HEMTs: Compensation of Interface Traps by Polarization Charges," IEEE Electron Device Letters, vol. 34, pp. 193-195, 2013. |