博碩士論文 101226050 完整後設資料紀錄

DC 欄位 語言
DC.contributor光電科學與工程學系zh_TW
DC.creator陳贊年zh_TW
DC.creatorTsan-nien Chenen_US
dc.date.accessioned2013-8-29T07:39:07Z
dc.date.available2013-8-29T07:39:07Z
dc.date.issued2013
dc.identifier.urihttp://ir.lib.ncu.edu.tw:88/thesis/view_etd.asp?URN=101226050
dc.contributor.department光電科學與工程學系zh_TW
DC.description國立中央大學zh_TW
DC.descriptionNational Central Universityen_US
dc.description.abstract本篇論文建立一套非接觸式、非破壞性的檢測物體內部缺陷深度與半徑的方法,利用在鎖相熱成像法中在物體輸入周期性變化的熱功率的特性導入熱波原理,藉由熱波原理控制檢測的深度。並根據有限元素分析軟體對不同缺陷深度與半徑進行模擬的結果建立一套使用週期性熱功率量測物體後,可以從量測的結果推算出在物體內部缺陷分布情形,並且同時得知缺陷深度與半徑的方法,最後進行實驗對模擬的結果進行確認。zh_TW
dc.description.abstractThis research successfully builds a non-destructive, non-contact detection method of determining the internal defect depth and defect radius in samples. In lock-in thermography method, the samples are measured by periodically changed heat flux. The effect about periodically changed heat flux is known as thermal wave effect. As thermal wave effect shows, the detection depth is related with the frequency of heat flux By finite element analysis software, the defect depth and defect radius we can be measured after using two difference frequency heat power detect a sample. The simulation results are proved by experiment.en_US
DC.subject鎖相熱成像zh_TW
DC.subjectzh_TW
DC.subject缺陷zh_TW
DC.subject檢測zh_TW
DC.subjectLock-in thermographyen_US
DC.subjectHeaten_US
DC.subjectDefecten_US
DC.subjectDetecten_US
DC.title鎖相熱影像檢測法用以檢測材料內部缺陷zh_TW
dc.language.isozh-TWzh-TW
DC.titleInternal defect detection using lock-in thermographyen_US
DC.type博碩士論文zh_TW
DC.typethesisen_US
DC.publisherNational Central Universityen_US

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