博碩士論文 101450025 完整後設資料紀錄

DC 欄位 語言
DC.contributor高階主管企管碩士班zh_TW
DC.creator彭彩員zh_TW
DC.creatorTsai-yuan Pengen_US
dc.date.accessioned2014-7-4T07:39:07Z
dc.date.available2014-7-4T07:39:07Z
dc.date.issued2014
dc.identifier.urihttp://ir.lib.ncu.edu.tw:88/thesis/view_etd.asp?URN=101450025
dc.contributor.department高階主管企管碩士班zh_TW
DC.description國立中央大學zh_TW
DC.descriptionNational Central Universityen_US
dc.description.abstract全球半導體景氣劇烈起伏、晶圓製造技術推進和電子產品朝向輕、薄、短、小的趨勢發展,使封裝測試技術難度及投資門檻均提高的情況下,國際IDM 大廠紛紛出售其麾下不具競爭力的封裝測試部門或將新增的封裝測試需求外包至專業封裝測試廠。 個案公司多年來封測產業產能的擴充,都聚焦在自身的核心業務上,投資秩序尚稱良好。而台灣在全球半導體製造供應鏈上,近年來已為Fabless、IDM廠產能積極佈局的重鎮,持續在高階產品、高階製程與低成本解決方案移轉來台,2013年台灣的半導體業皆有擴廠的重大投資。 半導體產業屬於規模經濟,個案公司面對同業的激烈競爭,如何擴大經營規模、爭取外包訂單以強化獲利,是存亡的關鍵;面對技術的發展,要如何快速獲得先進封測資訊及技術,以維持產業競爭力,更是公司長期發展之所繫。 本研究運用8十國家模式分析個案公司所處外在環境的機會與威脅;依據8十商業模式分析個案公司與競爭者的優勢與劣勢;運用8十獲利模式分析個案公司與競爭者的經營績效及財務狀況。再運用SWOT分析個案公司的競爭策略,找出個案公司的經營問題與對策,最後提供個案公司新商業模式及財務預測,做為本研究建議的參考。 本研究結論如下:  在半導體產業專業分工之發展趨勢下,IDM廠商基於經營成本效益及財務風險之考量,逐漸提高委託專業代工廠商生產之比例。 ● 個案公司將可收到IDM大單,提高營業收入。  在IC數量的不斷成長及半導體上游的擴張產出下,未來可以預期的,而客戶與製造商間須相互依存,共榮發展。 ● 個案公司與製造同業間既競爭又合作,逹到大者恆大,提高競爭優勢。  本研究依據改變後的商業模式,提供個案公司未來經營成果及獲利能力的分析。zh_TW
dc.description.abstractWhile global semiconductor industry booming and slumping vigorously, wafer manufacturing technology advances toward light, thin, short, small trends. Due to the increasing difficulty packaging and testing technology and investment barriers, the international IDM companies have to sell their less competitive packaging and testing department or outsource new demands to professional packaging and testing companies. The company case of packaging and testing are focused their expanded production capacity on their core business for many years and such investment is fairly good. Taiwan, within the global semiconductor manufacturing supply chains , in recent years has become the heartland that the Fabless, IDM companies actively continue to migrate their capacities in high-end products , advanced process and low-cost solution to. There are many company expansions and significant investments in Taiwan′s semiconductor industry in 2013. Semiconductor industry is economy of scale, the company case faces intense competition in the industry. It is the key to survival of how to expand the operation scale and seek for outsourcing orders to strengthen profitability. Facing the development of technology, how to timing acquire the information and advanced packaging and testing technology for maintaining industrial competitiveness is highly tied to the company long-term development. In this study, the company case is analyzed with 8 十national model of opportunities and threats in the external environment; analyzed based on 8 十business model of the company’s competitor strengths and weaknesses; analyzed with 8 十profit model of the company’s and their competitors’ operation performances and financial positions. Furthermore, by using SWOT analysis on the company’s competitive strategy to identify the company′s business problems and countermeasures, and finally provide the company case new business model and financial forecast. The whole study is suggested as a reference. The conclusions are as following: With the development trend of professional divisions in the semiconductor industry, IDM company gradually increase the proportion of production commissioned by external professional foundry based on cost-benefit considerations and financial risks. ● The company case will be able to acquire IDM significant orders and raise revenues. The expanded numbers of IC and output growing of upstream semiconductor companies, the future can be expected. The inter-dependence and mutual development for common prosperity are required between customers and manufacturers. ●The company case and the business competitors maintain the relationships of both competition and cooperation. The bigger the stronger, to enhance their competitive advantage. This study, according to the changed business model, provides analysis of future corporate business results and profitability.en_US
DC.subject台灣半導體封測產業zh_TW
DC.subject商業模式zh_TW
DC.subject經營績效zh_TW
DC.subjectTaiwan’s semiconductor packaging and testing industryen_US
DC.subjectBusiness modelen_US
DC.subjectBusiness performanceen_US
DC.title台灣半導體封裝測試業商業模式與經營績效關係之研究-以個案公司為例zh_TW
dc.language.isozh-TWzh-TW
DC.type博碩士論文zh_TW
DC.typethesisen_US
DC.publisherNational Central Universityen_US

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