|dc.description.abstract||Several problems are found in the etching process for printed circuit board industry which affect also the design of etching machines. The most important of them is the distribution quality of the etched thickness of the copper foil. In particular, the current transport method in the horizontal etching process is to use conveyor rollers for PCB manufacturing. The problems, such as the puddle effect, the scratches and pollution of PCB`s due to the surface contact with rollers, will seriously affect the overall quality of the follow-up products. It is therefore necessary to develop a new type of etching machine to overcome this problem.
The aim of this thesis is to propose a visualized method for the new etching process to study experimentally the correlation between the recorded imageds and design parameters. Additionally the design parameters are also validated by the accual etching process. In the qualitative conditions, the results from the experiment with a single nozzle spraying in high/low speed and forward/reverse conditions are at first studied. And then the experimental results in the case of the single nozzle in different eccentric positions along the forward/reverse are also used to verify the analysis of actual etching results. At last, the conditions of multiple nozzles and the related parameters are analyzed and discussed.
Finally, according to the conclusions obtained by the study with multiple nozzles, a optimized arrangement design. The uniformity of the optimized process can be up to 92.1%, which can effectively improve the quality of the current process. At the same time, the visualized experimental method established by this research cannot only shorten the design time and reduce the development cost, but also increase the competitiveness for marketing.||en_US|