| dc.description.abstract | The flexible substrate material is a new generation substrate technology with the advantages of continuous roll-to-roll production. The material needs to be light, thin, not easily broken, and easy to carry and bend. The molecular structure is related to the charge conduction rate and is affected by the morphology of the film when it is sputtered by a molecule. HIPIMS (high power impulse magnetron sputtering) is a high-power pulsed power supply for magnetron sputtering, which provides a low-porosity film at low temperatures.
In a flexible substrate, the thin film component undergoes repeated flexing, and the electrical influence of the flexographic film component is an interesting subject. In this experiment, a transparent conductive
film ITO was prepared using a flexible plastic to study the effect of deflection on its carrier transport ability. In this study, a flexible transparent conductive film was fabricated on a plastic substrate by HIPIMS method, and the characteristics of the components under different stresses were measured. We found that when the component is bent by compressive stress, the electrical difference of the component is large,and the number of bends that can be tolerated is small. On the contrary,
when the tensile stress is bent, the electrical difference is gentle, and the number of bends that can be tolerated is large.
We believe that the change of the stress of the component mainly comes from the change of the intermolecular force in the film: in the tensile stress state, the average free diameter between the grains and the grains becomes large, which causes the film to have micro-cracks, which makes the carrier mobility better. On the contrary, when the element is in a compressive stress state, the average free diameter between the crystal grains and the crystal grains becomes small, and the film is deformed,and the carrier mobility is thus lowered. | en_US |