| dc.description.abstract | Six Sigma is an integrated quality management approach, the application of scientific methods for process analysis, to understand the facts of the data presented and identify key quality characteristics to improve the quality of enterprise processes. In this thesis, DMAIC approach of Six Sigma is used to reduce the circuit board assembly plant motherboard LTE test failure rate. In ＂Define＂, listen to the customer′s voice, clearly define the target and turn into quantitative data, set a measurable target value, to determine the improvement of the target to meet customer needs. In ＂Measurement＂, assess and understand the status of a process, understand the performance of the process, the use of GR&R to assess the availability of measurement systems. In ＂Analysis＂, Cause and Effect Diagram (Fishbone Diagram) are used to analyze the different causes of this variation, and the possible causes of this variation are determined and transferred to failure mode and effect analysis (FMEA) to be tracked. In ＂Improve＂, use the results of the analysis to improve the process, adjust to optimize to solve the main source of variation, with failure mode and effect analysis (FMEA) to confirm whether the impact of improvement. In ＂Control＂, standardize the process and import the process and submit to the follow-up owners, the establishment of process control program to ensure that the process after the improvement of the results of stability and meet customer requirements. In this study, we propose an improvement plan for the analysis results. The improvement rate of the improvement is reduced from 10.44% to 0.21%, and the cost of rework for the circuit board is NT $ 4506050. | en_US |