| dc.description.abstract | In recent years, electronic digital products become lighter, the demand for flexible electronic products become higher and higher. Due to the water vapor transmission rate(WVTR) of the packaging is less than 10-3 g/m2/day, gas barriers on plastic substrates coatings are also becoming increasingly important.
In this study, plasma enhance chemical vapor deposition (PECVD) was used to control oxygen and hexamethyldisiloxane (HMDSO), and organic Si-O-Si films were being coated on the plastic substrate. Changing the gas flow can coat different structures of films. Therefore, a gas barrier film is stacked by the network structure of an inorganic film and the linear and cage structure of an organic film interlaced. Besides, a calcium test system was established to measure the water vapor transmission rate of the films. The physical and optical properties of the film layers were analyzed by a-step, atomic force microscope(AFM), ultraviolet/visible spectrophotometer(UV/VIS) and radius of curvature.
At the same thickness, the WVTR of the 3-Pair (substrate/buffer layer (50 nm)/barrier layer (100 nm)) is 7 x 10-3 g/ m2/day, but WVTR of the 6-Pair (substrate/buffer layer (25 nm)/barrier layer (50 nm)) reduced to less than measurement limit of 3 x 10-3 g/m2/day. Besides, the film of 4-Pair (substrate/buffer layer (50 nm)/barrier layer (100 nm)) stacking is too thick to be curved of the curvature radius of 2.43 cm. This is the reason why a crack is produced. The film can support a curvature radius of 2.43 cm and WVTR is as close to its measurement limit due to the increased bending resistance of the film layer in the 8-Pair (substrate/buffer layer (25 nm)/water blocking layer (50 nm) stack.
To sum up, 6-Pair (S/Buffer (25 nm)/Barrier (50 nm)) radius of curvature increased from 2.65 cm to 2.98 cm, WVTR less than x 10-3. g/m2/day, residual stress 112 MPa, surface roughness 1.28 nm, average transmittance 91.42% and the thickness is only 450 nm.
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