博碩士論文 106323059 完整後設資料紀錄

DC 欄位 語言
DC.contributor機械工程學系zh_TW
DC.creator許瑜峰zh_TW
DC.creatorYu-Feng Hsuen_US
dc.date.accessioned2020-2-5T07:39:07Z
dc.date.available2020-2-5T07:39:07Z
dc.date.issued2020
dc.identifier.urihttp://ir.lib.ncu.edu.tw:88/thesis/view_etd.asp?URN=106323059
dc.contributor.department機械工程學系zh_TW
DC.description國立中央大學zh_TW
DC.descriptionNational Central Universityen_US
dc.description.abstract隨著半導體產業的發展,各項電子設備的發熱密度增加,因此解決電子設備因高發熱量造成熱當機問題成了迫切的需求。傳統的空氣冷卻或單相水冷由於其熱傳係數低,難以應付高的熱通量,所以兩相蒸發冷卻系統成了解決高熱通量元件的散熱問題一種可能的解決方案。若欲解決相同熱傳量,由於液體之潛熱高於顯熱,因此兩相冷卻需要的流量比單相冷卻低得多,能夠降低所需要的泵動力。對於兩相蒸發冷卻系統的研究,許多人嘗試在兩相蒸發熱交換器中縮減流道尺寸以增加熱傳面積,但卻造成燒乾及汽泡回流問題。為了解決這些問題,本研究將應用本實驗室過去對微多孔表面增強沸騰熱傳之研究及微多孔表面熱交換器之初步結果,實際將微多孔塗層應用至適用於高熱通量散熱的直線型式及漸擴型式的熱交換器上,藉由微多孔塗層的大量成核孔洞及毛細吸力達到增強熱傳及延緩熱交換器燒乾。本研究中,我們設計了不同流道深度的直線蒸發熱交換器及漸擴流道的蒸發熱交換器,並使用平均粒徑尺寸約 20 µm 的鋁粉噴塗於蒸發熱交換器上,比較直線與漸擴流道及有塗層和無塗層的熱交換器的熱傳性能。 實驗結果顯示微多孔表面,流道深度 5 mm 的直線流道熱交換器有較好的熱傳性能,因流道深度較深,使流道內形成分層流,流道底部仍有液體流動,且微多孔表面的粒子堆積形成連結的通道,幫助液體補充至沸騰表面,使微多孔表面的燒乾情形延後發生。而漸擴流道的熱交換器因流道截面積隨著流動方向增加,降低汽泡往流道出口移動的壓降,使汽泡更容易往出口移動,減輕了汽泡回流與堵塞現象使熱傳能力增加。zh_TW
dc.description.abstractWith the development of the semiconductor industry, the heating density of electronic equipment has increased. Therefore, it has become an important issue to solve the problem of thermal crash caused by high heat generation of electronic equipment. Traditional air cooling or single-phase water cooling is difficult to solve such high heat flux due to its low heat transfer coefficient, so the two-phase evaporative cooling system has become a possible solution to the heat dissipation problem of high heat flux components. If the same heat transfer watts is to be solved, since the latent heat of the liquid is higher than the sensible heat, the flow requirement for two-phase cooling is much lower than that for single-phase cooling, which can reduce the pumping power. For the study of two -phase evaporative cooling system, many researchers tried to reduce the flow channel size which can increase the heat transfer area in the two-phase evaporative heat exchanger, but it caused the problems of dry out and bubble back flow. In order to solve these problems, this study will apply the previous research of enhanced boiling heat transfer performance with microporous surfaces and preliminary results of microporous surface heat exchangers in this laboratory, and actually apply microporous coating on straight channels and expansion type channel heat exchangers which are used for high heat flux heat dissipation, a large number of nucleated sites and capillary force of the microporous coating are used to enhance the heat transfer performance and delay the heat exchanger dries out. In this study, straight channel heat exchangers with different channel depths and expansion type channel heat exchanger are designed, and sprayed aluminum powder with an average particle size of about 20 µm on the heat exchangers. Compared the heat transfer performance with different type flow channel and coated and non-coated heat exchangers. The experimental results show that channel depth 5 mm straight channels heat exchanger with microporous surface has better heat transfer performance. Due to the deeper flow channel depth, a stratified flow is formed in the channel, so liquid still flows at the bottom of channel. In addition, the connected passage between particles can help liquid move into channel and wet the boiling surface and then delay the dry out. In the expansion type channel heat exchanger, because the cross-sectional area of the flow channel increases with the flow direction, so the pressure drop of bubbles move toward the outlet of the flow channel is reduced. Bubbles move to the outlet and reduce the bubble backflow and blockage phenomenon which increase heat transfer performance.en_US
DC.subject兩相冷卻zh_TW
DC.subject高熱通量元件散熱zh_TW
DC.subject微多孔塗層zh_TW
DC.subject直線流道zh_TW
DC.subject漸擴流道zh_TW
DC.subjectTwo-Phase coolingen_US
DC.subjectHigh heat flux components heat dissipationen_US
DC.subjectMicroporous coatingen_US
DC.subjectStraight channelen_US
DC.subjectExpansion type channelen_US
DC.title用於高熱通量電子元件之兩相蒸發冷卻系統zh_TW
dc.language.isozh-TWzh-TW
DC.type博碩士論文zh_TW
DC.typethesisen_US
DC.publisherNational Central Universityen_US

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