| dc.description.abstract | Nowadays, thanks to the well-developed chip technology, the science and technology has been improved by leads and bounds. Any smart home appliance that is made of chip has become indispensable part of modern life, such as computers, smartphones, et cetera. In fact, the breakthrough of chip technology mainly depends on the semiconductor processes, one of which is Local Electrochemical Deposition. Local Electrochemical Deposition is prone to produce a high aspect ratio stereo structure. Moreover, it can also use different materials and can be conducted under normal temperature and pressure. Furthermore, this process can form products by using stacked materials, which can lower the cost and reduce the waste at the same time. Consequently, Local Electrochemical Deposition is definitely a highly applicable, low-cost, low-energy, low-pollution, and safe manufacturing technology.
This paper is based on the concept of ＂image-guided local electrochemical deposition＂ and ＂non-isoaxial double-helix algorithm＂. We improved the anode-anode manufacturing method, enabling it to fabricate micro-scale double-helix microstructures, thus reducing the chance of system errors. Apart from it, we created an experimental data record module which records and analyzes the impact of changes in each parameter on the finished product. In addition, we simulated the effects that various electrochemical deposition parameters caused on double helix during the electroplating process. Also, we made an improvement of the equipment and the manufacturing process to enhance the reliability and the success rate of this system. And developed variable pitch double helix and controllable cylindrical double spiral plating system. At last, we carried out the analysis and discussion on the aspects of morphology, plating time, surface electric field simulation, maximum step rotation angle test and column diameter change. | en_US |