博碩士論文 107450037 完整後設資料紀錄

DC 欄位 語言
DC.contributor高階主管企管碩士班zh_TW
DC.creator詹益宏zh_TW
DC.creatorYi-Hung Chanen_US
dc.date.accessioned2020-6-1T07:39:07Z
dc.date.available2020-6-1T07:39:07Z
dc.date.issued2020
dc.identifier.urihttp://ir.lib.ncu.edu.tw:88/thesis/view_etd.asp?URN=107450037
dc.contributor.department高階主管企管碩士班zh_TW
DC.description國立中央大學zh_TW
DC.descriptionNational Central Universityen_US
dc.description.abstract本研究藉由晶圓測試廠製程所使用的主要設備種類,包含測試主機、探針機以及探針卡,找出探針卡是影響整體設備效率的關鍵因素。在產能規劃過程中,可支援生產的探針卡數量相對受到限制,原因是探針卡建置數量是依據晶圓產品型號而定,並且無法與其他型號共用,加上探針卡狀況容易隨著測試活動的增加而每況愈下。因此在測試廠的產能規劃範疇中,狀態良好的探針卡數量是決定產能多寡的最重要因素。因此,發展出一套有效的現場管理策略,將手中有限的生產資源發揮最大經濟效益,就能有效的提升整體設備效率。 個案公司之所以能夠有效提升整體設備效率的成功關鍵有兩點,第一點重視及時處置對整體設備效率帶來正面改善:以實際的例子發現,當違反統計分類限制觸發時採取及時處置,雖然會造成當下機台的當機以及需要重新架機的時間增加,但卻可以大幅改善產品重工的時間。採取及時處置的策略可使得產品良率問題擴大之前,便以較小的代價恢復機台的有效產能。第二點發展混合式探針卡及時處理策略:單一的探針卡處理策略,僅能優化單一項目的機台狀態,卻無法兼顧其他項目的機台狀態,導致整體設備效率非最佳化。混合式處理策略可兼顧三項機台狀態的績效皆保持一定水準,避開單一項目最差而拖累整體設備效率的情況。因此發展混合式探針卡及時處理策略,會對整體的生產效能提升有較大助益。zh_TW
dc.description.abstractIn this study, the main types of equipment used in the wafer sort, including tester, prober and probe card. Find the probe card is a key factor. In the capacity planning process, the number of probe cards that can be supported for production is relatively limited, because the number of probe cards built depends on the wafer product and cannot be shared with other product, plus the status of the probe card is easy to follow with the increase in testing activities, the situation is getting worse. An effective on-site management strategy has been developed to maximize the benefits of the limited probe card in hand, and the overall equipment effectiveness can be effectively improved. There are two key conclusions to make it happened. The first key conclusions is emphasis on timely disposal brings positive improvement to the overall equipment effectiveness:This study found that with practical examples, timely disposal is taken when the violation of statistical classification restrictions is triggered. Although it will cause the machine downtime and required to reinstall the machine. However, it can greatly improve the time for product reworking. The second key conclusions is develop multi-actions for probe card timely processing strategy:A single action can only optimize the machine status of a single downtime, resulting in non-optimized overall equipment effectiveness. The multi-actions strategy can reduce the three down time and maintain a certain level, avoiding the worst situation of a single down time and dragging on the overall equipment effectiveness.en_US
DC.subject晶圓測試廠zh_TW
DC.subject整體設備效率zh_TW
DC.subject半導體zh_TW
DC.subjectWafer Sorten_US
DC.subjectOverall Equipment Effectivenessen_US
DC.subjectSemiconductoren_US
DC.title晶圓測試廠之提升整體設備效率方法研究-以A公司為例zh_TW
dc.language.isozh-TWzh-TW
DC.type博碩士論文zh_TW
DC.typethesisen_US
DC.publisherNational Central Universityen_US

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