| dc.description.abstract | With the advent of the Internet era, the demand for wearable devices has been continuously increasing, making the reliability of these devices a critical concern. The quality of precision circuits in wearable devices is crucial, as any defects during the manufacturing process can directly impact the accuracy and sensitivity of the device, ultimately affecting its overall reliability.
To address these concerns, this research focused on a specific brand of wearable device that exhibited anomalies during reliability loop testing. Through the analysis of a fishbone diagram, the main cause of the anomalies was identified, which was the abnormal functioning of the micro-etching groove in the electroplating process, resulting in poor adhesion between the electroplated copper and the base copper. To resolve this issue, the study utilized an oscillation sensing chip to monitor the oscillation mechanism of the micro-etching groove and further investigated the impact of the micro-etching groove′s oscillation conditions on production quality.
The experiment determined that an oscillation frequency of ≥40 Hz with an on/off duration of 20/10 seconds achieved optimal etching conditions at the hole bottom. By analyzing the collected oscillation data from the oscillation mechanism, the research successfully quantified the oscillation parameters of the equipment during six different frequency trips, presenting them in a trend chart for equipment failures.
Through the analysis and exploration of the micro-etching groove′s oscillation conditions, the research not only addressed the issue of poor adhesion between electroplated copper and the base copper but also enabled the intelligent application of equipment failure prediction. This approach facilitates real-time detection of potential weakening signs, reducing downtime risks, and improving production efficiency and product quality. | en_US |