博碩士論文 108323001 完整後設資料紀錄

DC 欄位 語言
DC.contributor機械工程學系zh_TW
DC.creator吳彥廷zh_TW
DC.creatorYan-Ting Wuen_US
dc.date.accessioned2021-6-18T07:39:07Z
dc.date.available2021-6-18T07:39:07Z
dc.date.issued2021
dc.identifier.urihttp://ir.lib.ncu.edu.tw:88/thesis/view_etd.asp?URN=108323001
dc.contributor.department機械工程學系zh_TW
DC.description國立中央大學zh_TW
DC.descriptionNational Central Universityen_US
dc.description.abstract在半導體元件技術的發展下,受惠於未來的趨勢如5G通訊和AI人工智慧,對元件的需求持續增加,其中SOI具備高效能和低功耗的特性, 其中smart cut製程是製作SOI最主流的方式。 本研究針對氫離子佈值後氫和矽晶圓的交互作用,我們使用TRIM模擬軟體模擬相同參數下離子佈值的射程分佈以及空位分佈,接著使用SIMS,TEM和拉曼光譜等儀器去檢測氫在矽晶圓裡的分佈,可以觀察到SiO2/Si界面有明顯的氫峰值出現,可以推測為界面的陷阱效應,並且在試片的TEM剖面圖中觀察到明顯的裂縫,此裂縫位置剛好坐落在損傷最高的位置。zh_TW
dc.description.abstractWith the development of semiconductor device technology, benefit from future technological trends such as 5G communications and AI artificial intelligence, the demand for device continues to increase. Among them, SOI has the characteristics of high performance and low power consumption, and smart cut is the most mainstream way to make SOI. This research focuses on the interaction between hydrogen and silicon wafers after hydrogen ion implantation, we use TRIM simulation software to simulate the ion range and vacancy distribution under the same parameters. Then we use SIMS, TEM and Raman spectroscopy instruments to detect the distribution of hydrogen in the silicon wafer, it can be observed that there is an obvious hydrogen peak at the SiO2/Si interface, it can be inferred as the trap effect of the interface. In addition, obvious cracks were observed in the TEM cross-section profile of sample, and the position of the crack was just at the position with the highest damageen_US
DC.subject離子佈值zh_TW
DC.subject絕緣層上矽zh_TW
DC.subject擴散zh_TW
DC.subject界面陷阱zh_TW
DC.subjectIon implantationen_US
DC.subjectSOIen_US
DC.subjectdiffusionen_US
DC.subjectinterface trapen_US
DC.title氫離子佈值Si/SiO2薄膜覆蓋矽中之空位對氫擴散之效應zh_TW
dc.language.isozh-TWzh-TW
DC.titleThe effect of the vacancy of Si/SiO2/Si implanted by hydrogen ion on hydrogen diffusionen_US
DC.type博碩士論文zh_TW
DC.typethesisen_US
DC.publisherNational Central Universityen_US

若有論文相關問題,請聯絡國立中央大學圖書館推廣服務組 TEL:(03)422-7151轉57407,或E-mail聯絡  - 隱私權政策聲明