| dc.description.abstract | In this study, a real-time image-guided micro-plating method was used to fabricate copper micropillars. A platinμm wire with a wire diameter of 250 μm was used as the anode, a copper wire with a wire diameter of 0.643 mm was used as the cathode, and the distance between the cathode and anode was 80 μm. It is hoped to produce copper micropillars and microspirals with high strength and high conductivity. The research goal is to explore the effect of adding different concentrations of thiourea and thiourea derivatives on the surface morphology, chemical composition, crystal structure, mechanical properties and corrosion resistance of micro-column deposition. SEM, TEM and XRD were used to analyze the surface morphology. Observation and grain analysis; using micro Vickers and nanoindentation test to measure the physical properties of copper micropillars; using four-wire measurement method to measure the electrical conductivity of copper micropillars with different parameters; The column was immersed in an aqueous solution of 3.5 wt.% NaCl with a pH of 8, and electrochemical tests were performed to compare its corrosion behavior using a potentiostat.
The results show that the maximμm Vickers hardness of 265 HV, the maximμm nanoindentation hardness of 2.93 GPa, the positive modulus of 87.53 GPa and the electrical conductivity reaches 5.09 × 107 S. m-1, about 85.52% efficiency of copper can be obtained when allyl thiourea is used in the plating solution.. The corrosion potential is -0.22 V (vs. SHE), the corrosion current is 0.004 mA/cm2, and the anode slope is 59 mV dec-1.
The optimμm electroplating conditions for making micro-pillars are sμmmarized, and then the feasibility of making micro-helix, is discussed based on these conditions, and the influence of micro-helix, precipitation angle and process parameters on micro-helix, size and wire diameter uniformity is studied. | en_US |