| dc.description.abstract | The heat bring by the process and broadband speed of electronically device raised substantially recent years, is becoming the task every designer’s nightmare. Designed upon the past experience, improved along lots of trial and error to achieve the final target normally come with extensive time and cost; The scope of this research is to analyze and discover the best strategy for maximize the performance of the thermal solution within the limit of time with systematic trial and theory.
The simulation is setup and planed base on Taguchi Methods and using the heat flow analyze tool, FloTHERM12; The quality characteristics is low temperature (smaller-the-better) and the orthogonal array table L9(34), target the factors: heat radiation (A), thermal conductivity of thermal pad(B), quantities of the Fins(C) and height of the Fins(D). The optimal parameters of the thermal solution is: A3B3C2D3, heat sink coating with graphene, thermal pad with 5 W/(m·K) conductivity, contain 10 fins with height 45mm. The research results found that the critical factor is the thermal conductive silicone sheet, its S/N ratio is 0.34, and the temperature difference between each level reaches 3.63°C. However, in the main electronic parts, the S/N ratio is increase to 0.56, and the temperature difference between each level reaches 5.85°C. The relative error between simulation result and experiment is 3.01%; this proved the thermal simulation is creditable.
The combination of the Taguchi Method and Minitab statistics analyze applied during the product development, provide the design of thermal solution better accurate and consuming less time. | en_US |