DC 欄位 |
值 |
語言 |
DC.contributor | 機械工程學系 | zh_TW |
DC.creator | 陳崴淇 | zh_TW |
DC.creator | Chen WeiChi | en_US |
dc.date.accessioned | 2022-8-30T07:39:07Z | |
dc.date.available | 2022-8-30T07:39:07Z | |
dc.date.issued | 2022 | |
dc.identifier.uri | http://ir.lib.ncu.edu.tw:88/thesis/view_etd.asp?URN=109323086 | |
dc.contributor.department | 機械工程學系 | zh_TW |
DC.description | 國立中央大學 | zh_TW |
DC.description | National Central University | en_US |
dc.description.abstract | 硬脆材料加工為當今一大重要研究課題之一,目前在面板、半導體以及各式精微加工皆面臨諸多難題。在傳統加工多使用機械式鑽削進行加工,但由於使用材料為硬脆材料,在加工時容易產生脆性破裂問題。
本論文使用複合加工方式,先使用雷射改質,將待鑽孔位置進行局部軟化,接著使用影像定位技術,將高速主軸對準雷射改質區域,再以高速雕銑機進行二次複合加工。
本篇論文使用易盟科技股份有限公司所開發之CM-650高速雕銑機進行實驗,搭配兩台CCD攝影機建立視覺系統,並使用C#進行座標轉換及影像處理之人機介面。 | zh_TW |
dc.description.abstract | The processing of hard and brittle materials is one of the most important research topics nowadays. There are many difficulties while facing panels, semiconductors and various micro-processing currently. Drills are often used in traditional processing. Fragments is easy to occur during processing hard and brittle materials.
In this thesis, a composite processing method is used. First, laser modification is used for partially softening. Then, image positioning technology is used to align to the laser-modified area, and a high-speed machine is used for secondary hybrid processing.
The CM-650 high-speed machine developed by Yimeng Technology Co., Ltd. is used in this paper, two CCD cameras are used to establish a visual system, coordinate conversion and image processing human-machine interface are designed by C#. | en_US |
DC.subject | 高速雕銑機 | zh_TW |
DC.subject | 鑽孔 | zh_TW |
DC.subject | 影像處理 | zh_TW |
DC.subject | 座標轉換 | zh_TW |
DC.subject | High Speed Machine | en_US |
DC.subject | Drilling Process | en_US |
DC.subject | Image Processing | en_US |
DC.subject | Coordinate Transformation | en_US |
DC.title | 硬脆材料複合加工與視覺影像定位系統之初步研究 | zh_TW |
dc.language.iso | zh-TW | zh-TW |
DC.type | 博碩士論文 | zh_TW |
DC.type | thesis | en_US |
DC.publisher | National Central University | en_US |