| dc.description.abstract | In recent years, electronic communication products have gradually become an indispensable part of life. With the improvement of transmission rate and distance, electronic products are developing towards miniaturization and multi-functionality. The accompanying high temperature has become the main problem of electronic communication products. Under long-term operation in a high temperature environment, electronic products are prone to problems such as failure of electronic components, material aging, and internal solder joints falling off. In addition, the development cycle of electronic products is short. In the past, product design was carried out through experience and testing methods, which cost a lot of money and time.Therefore, it is necessary to quickly solve the thermal problem of electronic communication products through systematic design.
In this study, the computational fluid dynamics method is used to simulate the heat transfer phenomenon of fiber optical transceiver using the Flotherm simulation software.The main heat dissipation path of fifer optical transceiver is: Integrated Circuit Thermal Pad Quad Small Form-factor Pluggable Heat sink. The Taguchi method is used for the design of this heat dissipation path, and the temperature is regarded as the quality characteristic.We consider the following control factors, which are the material of thermal pad(A), the material of heat sink(B), the contact thermal resistance between the integrated circuit and thermal pad(C), the contact thermal resistance between the thermal pad and quad small form-factor pluggable(D), the contact thermal resistance between the quad small form-factor pluggable and cage(E), the contact thermal resistance between the quad small form-factor pluggable and heat sink(F), the contact thermal resistance between the cage and heat sink(G). The top three of the importance of thermal design to temperature are: D control factor, C control factor and F control factor. The best factor level combination of Taguchi method is A3B3C1D1E1F1G2, the number is the level of each control factor. After statistical verification, the best factor level is A3B3C1D1E1F1G1. The reason is that the G control factor is not the main heat dissipation path, and its importance to temperature is very low, and in the analysis of Taguchi method, the G control factor is manipulated by the F control factor, so it gives the wrong optimal solution. When thermal problems occur in fiber optical transceiver, the results of this paper can be a reference, providing a fast and effective solution. | en_US |