| dc.description.abstract | In this study, a multi-layer composite vapor chamber is designed, with a copper column above the center of the heat source. Taking advantage of the large cross-sectional area of the copper column, it has low thermal resistance and relatively high heat transfer. It is expected to reduce the temperature difference on the upper part of the fins and improve overall cooling performance. The fins and the vapor chamber are combined into a module, and the modules are stacked according to different heat dissipation requirements to achieve flexibility to solve different heat dissipation purposes.
According to the results of heat transfer experiments, at the same wind speed, the modularized finned vapor chamber has a larger thermal resistance than the non-modularized finned vapor chamber, which increases by about 5% to 12%. The resistance is slightly increased, which is still acceptable, because the modular vapor chamber fins can respond to different heat dissipation requirements more quickly. | en_US |