| DC 欄位 |
值 |
語言 |
| DC.contributor | 化學工程與材料工程學系 | zh_TW |
| DC.creator | 賴昱沅 | zh_TW |
| DC.creator | Yu-Yuan Lai | en_US |
| dc.date.accessioned | 2022-9-22T07:39:07Z | |
| dc.date.available | 2022-9-22T07:39:07Z | |
| dc.date.issued | 2022 | |
| dc.identifier.uri | http://ir.lib.ncu.edu.tw:88/thesis/view_etd.asp?URN=109324006 | |
| dc.contributor.department | 化學工程與材料工程學系 | zh_TW |
| DC.description | 國立中央大學 | zh_TW |
| DC.description | National Central University | en_US |
| dc.description.abstract | 近年來隨著三維構裝興起，低溫製程能有效地減緩基板翹曲，提升系統長期可靠度。Sn-58Bi 銲料具有良好地濕潤性、抗潛變能力以及139℃的低熔點溫度，對於先進電子構裝來說非常具有吸引力。文獻指出Sn-58Bi 於長時間熱時效處理後，將會生成一連續脆性富Bi 層於基板處界金屬化合物上方，介金屬化合物與基板間有孔洞生成，大幅降低銲料機械性質。本研究透過加入SAC0307 於Sn-56.8Bi-1Ag-0.2Cu 下方形成一複合結構，觀察複合銲料於熱時效處理後微結構變化與機械性質改變。由剛迴焊完橫截面結果發現，SAC0307 層的添加有效降低整體銲料富Bi 區域。由SnBiAgCu/SAC 彼此間液相/固相動力學分析結果確認了Sn 溶解速率隨迴焊溫度提升而加快。經由熱效處理後，於下層SAC 區域發現大量細小Bi 顆粒析出於其中，並於後續機械性質探討中，對複合銲料推力值與破斷模式隨老化溫度提升和老化時長拉長而改變進行一系列探討。 | zh_TW |
| dc.description.abstract | Low-temperature bonding approach has become an inevitable trend in advanced electronics packaging technology. Low reflow temperature process can enhance the reliability of devices by minimizing warpage. SnBi eutectic solder is considered as one of the best candidates due to the advantages of good wettability, creep resistance and low melting point. A continuous Bi-rich layer formed between solder matrix and Cu6Sn5 layer after aging significantly decreases the strength of solder joint. In this study, a SAC layer was added between SnBiAgCu and Cu substrate to create a composite structure. The addition of SAC layer reduces the ratio of Bi-rich phases in the SnBiAgCu matrix. Small Bi precipitates are distributed uniformly in the SAC layer after long-term aging. Cross-section images are examined to analyze the kinetics of phase transformation. Shear test and fracture surface are adopted to analyze the joint strength and failure mode. The results show that the mechanical properties of the solder joint are improved by the composite structure of the solder. | en_US |
| DC.subject | 無鉛銲料 | zh_TW |
| DC.subject | 錫鉍 | zh_TW |
| DC.subject | 錫銀銅 | zh_TW |
| DC.subject | 低溫構裝 | zh_TW |
| DC.title | 應用於低溫電子構裝製程之錫鉍/錫銀銅複合銲料 | zh_TW |
| dc.language.iso | zh-TW | zh-TW |
| DC.type | 博碩士論文 | zh_TW |
| DC.type | thesis | en_US |
| DC.publisher | National Central University | en_US |