| dc.description.abstract | Sapphire substrates are often used as materials for optoelectronic components and substrates because of their high-temperature resistance, high hardness, corrosion resistance, high light transmission, and high dielectric coefficient with the rise of the 5G industry. However, the excellent characteristics of the sapphire substrate also make it more difficult to be processed than other materials. The trend of consumer electronic products is becoming lighter, thinner, and shorter, which makes the requirements for processing size and precision continue to shrink, and traditional processing methods are gradually difficult to meet these requirements. In recent years, the laser source of ultra-short pulse laser has been gradually commercialized, and it is regarded as one of the potential tools. The research on hard and brittle materials such as sapphire using pulse laser has also gradually increased. This research integrates the femtosecond laser with a high-speed and high-precision six-axis platform, establishes laser processing system to achieve the relative motion between the laser and the material, and plans the laser for a sapphire with a thickness of 200 μm. The processing path is to place the material under water to complete the drilling of micro-holes, analyze the influence of different situations on the laser processing, and improve the hole quality. | en_US |