DC 欄位 值 語言 DC.contributor 電機工程學系 zh_TW DC.creator 何宗翰 zh_TW DC.creator Zong-Han He en_US dc.date.accessioned 2023-12-19T07:39:07Z dc.date.available 2023-12-19T07:39:07Z dc.date.issued 2023 dc.identifier.uri http://ir.lib.ncu.edu.tw:88/thesis/view_etd.asp?URN=109521015 dc.contributor.department 電機工程學系 zh_TW DC.description 國立中央大學 zh_TW DC.description National Central University en_US dc.description.abstract 晶圓在製造過程中難免會有一些缺陷，造成晶圓上的缺陷原因有很多種，因此，工程師透過晶圓針測結果產生的晶圓圖，觀察其錯誤晶粒分佈，進而分析製造過程中錯誤原因。現今主要分成九種的錯誤樣態，分別為Center、Donut、Scratch、Edge-Loc、Loc、Near-full、Edge-Ring、Random和none，這些錯誤樣態都是由工程師以肉眼觀察晶圓圖找出，然而去分類錯誤樣態沒有一致的定義，主要都是以工程師的主觀判定，所以會造成判定上的分歧。 本論文的目的是進行錯誤樣態的特徵參數提取，主要是對台積電所提供的WM-172K資料集，將其轉換成圖片和利用影像處理及聚類演算法去找到最大群聚，再進行區域及統計方面上做特徵參數的提取，提取後得到各個參數的分布結果，並且利用盒鬚圖找到每種錯誤樣態的重要特徵參數數值區間。 最後，我們利用特徵參數的數值區間進行錯誤樣態的標記，對於WM-172K的7種樣態，平均準確度可達74.69%。 zh_TW dc.description.abstract Some inevitable defects exist during wafer manufacturing process. There are many reasons for these defects. Therefore, engineers observe the distribution of bad dies after testing and analyse the causes of errors in the manufacturing process. We often categorize defect patterns into nine types, which are Center, Donut, Scratch, Edge-Loc, Loc, Near-full, Edge-Ring, Random, and none. These patterns need to be automatically identified as fast as possible after wafer testing. In this paper, we define and extract many feature parameters of defect patterns on wafer maps of WM-172K dataset. We use image processing and clustering algorithms to find the largest cluster for each map. Then, the feature parameters are extracted for the regional and statistical attributes, respectively. The distribution results of each parameter are obtained. We use Box Plot to mark the numerical interval of each feature parameter for each defect pattern. Finally, using the numerical intervals of feature parameters to rate the scores of defect patterns of WM-172K, we can obtain the average accuracy of 74.69% for seven types of defect patterns. en_US DC.subject 晶圓圖 zh_TW DC.subject 錯誤樣態 zh_TW DC.subject 特徵參數 zh_TW DC.subject WAFER BIN MAP en_US DC.subject DEFECT PATTERN en_US DC.subject FEATURE PARAMETERS en_US DC.title 晶圓圖提取特徵參數錯誤樣態分析 zh_TW dc.language.iso zh-TW zh-TW DC.title Extracting Feature Parameters for Analysis of Defect Patterns on Wafer Bin Maps en_US DC.type 博碩士論文 zh_TW DC.type thesis en_US DC.publisher National Central University en_US