| dc.description.abstract | This paper is divided into five chapters. We explain the development of packaging and its importance in Chapter 1, and then introduce the common packaging connection methods (bond wire, ball grid array, and flip chip packaging). Then, we show that the reflection and transmission loss of bond wire is particularly serious when bond wire package is applied to the millimeter wave band because of its inherent low-pass filter characteristics. If the signal degradation can be improved, the potential of the bond wire package in the millimeter wave band will be realized.
We examines the characteristics of bond wire package in Chapter 2. First, we consider the effect of adding packaging materials on the package circuit that transmits signals by bond wire, and simulate the effect of low-loss and high-loss packaging materials on the bond wire circuit. Then, in order to effectively analyze the electrical characteristics of the bond wire package, a quasi-static-based analysis method is presented for the bond wire structure, and a bond wire equivalent circuit model is developed with accuracy covering DC to 40 GHz.
Chapter 3 is to verify the accuracy of the equivalent circuit model by measurement. First, we design the bond wire package circuit structure using the PCB process and the WIPD wafer process, and then build the bond wire equivalent circuit model based on the quasi-static analysis method proposed in Chapter 2. Then, since the measurement results of the bond wire package circuit include the S-parameter response of the transmission structure fed to the bond wire, we use the Through-Line-Line de-embedding method to remove the feed-in transmission structure response in order to compare the measurement results with the bond wire equivalent circuit. Finally, we compare the HFSS simulation results for a single bond wire, the calculation results for the bond wire equivalent circuit, and the measurement results with only the S parameter of the bond wire after correction. The results of the three comparisons are in reasonable agreement, confirming that the bond wire equivalent circuit built by the quasi-static analysis method we proposed in Chapter 2 can be applied to the millimeter wave band.
Chapter 4 is to discuss and improve the effect of bond wire package. Because of the low-pass filtering effect of the bond wire itself, the signal is seriously reflected in the millimeter wave band. In order to improve this drawback and make the bond wire package suitable for the millimeter wave band, we will design a matching circuit for the bond wire structure by adjusting the shape of the bond wire, using a ribbon bond wire to transmit the signal, adding capacitive open stubs to the bond wire circuit structure, and using two bond wires for matching on the signal line. Finally, we present a method of simulating boundary conditions to consider the use of multiple bond wires for signal transmission similar to the QFN, which allows for a quick analysis of coupling effects that may be more severe when multiple bond wires are employed for signal transmission.
The conclusion and future work are provided in Chapter 5.
Key words : millimeter wave, package, bond wire, equivalent circuit model | en_US |