| dc.description.abstract | With the increasing demand for higher transmission rates in the field of communications, people are searching for solutions that offer more advantages than traditional copper wire transmission. In this context, the application of silicon photonics has become an appealing option. Silicon photonics utilizes optical waveguide technology not only to achieve higher transmission rates and broader bandwidth but also to reduce energy loss. Silicon photonic systems are primarily composed of photonic circuits and electronic circuits to facilitate signal transmission and calculations.
To begin, the electrical signal is converted into an optical signal through a laser modulator, then transmitted via optical fiber and optical waveguide. Finally, the optical signal is reconverted into an electrical signal by an optical receiver. In optical fiber communications, high-power broadband light sources, such as optical amplifiers and Raman lasers, play pivotal roles in various fields including communications, medicine, and spectroscopy. However, multi-level integration and low-cost mass production in the realm of silicon photonics are currently underdeveloped. Aspects like the U-Groove (on-chip) structure, Heater (on-chip) structure, and ongoing research on process integration are still in their infancy. Furthermore, implementing mass production with commercial economic benefits is even more challenging.
In this study, we integrated waveguide micro-resonators and U-Groove structures using cost-effective I-line stepper lithography technology on a 6-inch full wafer
IV
as an initial exploration. This work can be extended in the future to employ 8-inch or even 12-inch processes and integrate additional component structures. In our research, we achieved a high quality (Q) factor of up to 105 for low-loss silicon nitride (SiN) waveguide micro-resonators. The completed chip can withstand high power and maintain long-term stability. Furthermore, the waveguide micro-resonator and U-Groove structure can be integrated through a six-inch full-wafer process, offering a long-term stability solution for coupling and packaging. This integration also verifies the uniformity of different chip areas across the wafer, ensuring the high quality of the silicon photonic devices manufactured. This process integration of photonic components holds the potential for mass production, high throughput, and uniform manufacturing. | en_US |