| DC 欄位 |
值 |
語言 |
| DC.contributor | 化學工程與材料工程學系 | zh_TW |
| DC.creator | 陳文泰 | zh_TW |
| DC.creator | Wen-Tai Chen | en_US |
| dc.date.accessioned | 2002-7-8T07:39:07Z | |
| dc.date.available | 2002-7-8T07:39:07Z | |
| dc.date.issued | 2002 | |
| dc.identifier.uri | http://ir.lib.ncu.edu.tw:88/thesis/view_etd.asp?URN=89321011 | |
| dc.contributor.department | 化學工程與材料工程學系 | zh_TW |
| DC.description | 國立中央大學 | zh_TW |
| DC.description | National Central University | en_US |
| dc.description.abstract | 隨著環保聲浪的抬起，目前工業界打算採用無鉛銲料，用來取代63Sn-37Pb含鉛銲料。本論文探討錫銅無鉛銲料與Ni間之反應，此一銲料在波銲製程或是迴銲製程上皆有其應用性。本研究探討液態Sn-Cu銲料中微量銅濃度的變化，與Ni基材之反應情形，此一研究，除上述液態反應研究外，本論文也深入探討固態Sn-Cu銲料與Ni之反應，發現一很有趣的現象，即銲料中Cu濃度的些許變化，大幅度的影響界面生成物之種類及形態。
本研究所選用的Sn-xCu銲料，其x分別為0.2、0.4、0.6、0.7、1及3 (wt.%)。在液態反應實驗中，發現微量銅濃度變化，造成界面上介金屬化合物的種類及形態明顯的不一樣。當銅濃度低時(Sn-0.2Cu)，界面上生成一層連續的(Ni1-xCux)3Sn4化合物；當Cu濃度高時(Sn0.6Cu ~ Sn1Cu) ，界面上生成(Cu1-yNiy)6Sn5化合物；而當銅的濃度介於上二者之間 (Sn-0.4Cu) 時，在界面上(Ni1-xCux)3Sn4及(Cu1-yNiy)6Sn5同時存在。
但在固態反應實驗中，Cu濃度變化的影響較不重要，此時溫度及時間的影響較為主要，在不同溫度及不同的反應時間下，界面上之化合物種類也不同。在反應溫度225℃，反應時間由25小時~400小時之間，不管Cu濃度變化如何，界面上之生成物永遠以二層存在，底下接近Ni層的為(Ni1-xCux)3Sn4相，其上頭化合物為(Cu1-yNiy)6Sn5。
在介金屬生長速率的分析上，本研究由液態反應實驗發現介金屬化合物遵循反應控制，而固態反應則遵循擴散控制。
由本研究結果發現，工業界選用Sn-Cu銲料時，對於Cu濃度的控制，必須非常的精確，因為只差0.2 wt.%的Cu濃度，界面上生成物種類及形態明顯不同，嚴重影響界面上化合物之機械性質。故銲料組成中Cu金屬濃度必須控制在0.1 wt.%之內，以確保產品品質。 | zh_TW |
| dc.description.abstract | The eutectic 99.3Sn-0.7Cu solder (wt%, Sn-0.7Cu) is the most promising lead-free replacement for the eutectic Sn-Pb solder in wave-soldering applications. In this study, the effect of a small perturbation in the Cu concentration on the reaction between the Sn-0.7Cu solder and Ni was investigated. Specifically, four Sn-xCu solders (x = 0.2, 0.4, 0.7, and 1) were reacted with Ni at 250 degreesC. A slight variation in Cu concentration produced completely different reaction products. When the Cu concentration was low (x = 0.2), the reaction product was (Ni1-xCux)(3)Sn-4. At high Cu concentrations (x = 0.7 and 1), the reaction product was (Cu1-yNiy)(6)Sn-5. When the Cu concentration was in-between (x = 0.4), both (Nil-xCux)(3)Sn-4 and (Cu1-yNiy)(6)Sn-5, formed. The above findings were rationalized using the Cu-Ni-Sn isotherm. the results of this study imply that the Cu concentration must be strictly controlled in industrial production to produce the desired intermetallic at the interface. | en_US |
| DC.subject | 波銲 | zh_TW |
| DC.subject | 鎳 | zh_TW |
| DC.subject | 錫銅 | zh_TW |
| DC.subject | 無鉛銲料 | zh_TW |
| DC.subject | 共晶 | zh_TW |
| DC.subject | wave-soldering | en_US |
| DC.subject | lead-free solder | en_US |
| DC.subject | Sn-0.7Cu | en_US |
| DC.title | 錫銅無鉛銲料與Ni基材界面反應之研究 | zh_TW |
| dc.language.iso | zh-TW | zh-TW |
| DC.title | Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders | en_US |
| DC.type | 博碩士論文 | zh_TW |
| DC.type | thesis | en_US |
| DC.publisher | National Central University | en_US |