| dc.description.abstract | Due to their stability, safety and low toxicity, PFCs are widely used in industrial production, especially semiconductor manufacturing processes. But molecular bonds between F and C、N、S have strong capacities on infrared rays absorption, they will aggravate global warming once emitted into the atmosphere. Thus, how to effectively control PFC emissions to alleviate the increasingly deteriorated phenomenon has become the focus of scientific researches.
In addition to increasing the efficiency of utilizing PFCs, the semiconductor industry applies alternative chemicals, recovery/recycle systems and abatement techniques. Owing to the difficulty in development of alternative chemicals and high cost in recovery/recycle systems, the abatement techniques have become the primary way to control PFC emissions at present stage. This study investigates the effectiveness of plasma technology which has high temperature (central temperature 3,000 ℃ up) and low energy consumption (compare to burning), combined with catalysis technology which can lower activation energy for NF3 removal.
Results of the study indicate that both Ni and Pd catalyst are good at destroying and removing NF3 in 300 ℃. Destruction and removal efficiency of NF3 can be enhanced by more than 20 % if combined with plasma. Besides, poison of the catalysts can be alleviated with plasma on. As for the energy efficiency, if more than 18 % of the input energy is devoted to the reactor, plasma combined with catalyst has a higher energy efficiency compared with catalyst-only cases.
Major products detected in this study include are NO、NO2 and N2O for both plasma and catalysis destruction of NF3. Due to the difficulty of fluoride measurement, products analysis is not complete in this investigation, further studies are needed to better understand the reaction mechanisms. | en_US |