| DC 欄位 |
值 |
語言 |
| DC.contributor | 機械工程學系 | zh_TW |
| DC.creator | 儲德鋒 | zh_TW |
| DC.creator | Der-Fong Chu | en_US |
| dc.date.accessioned | 2004-7-3T07:39:07Z | |
| dc.date.available | 2004-7-3T07:39:07Z | |
| dc.date.issued | 2004 | |
| dc.identifier.uri | http://ir.lib.ncu.edu.tw:88/thesis/view_etd.asp?URN=91323043 | |
| dc.contributor.department | 機械工程學系 | zh_TW |
| DC.description | 國立中央大學 | zh_TW |
| DC.description | National Central University | en_US |
| dc.description.abstract | 摘 要
近年來電子及相關科技產業的快速發展，產品設計除了要求『輕、薄、短、小、多樣化』外，電子微處理器的運算速度及效能提昇已成為未來電子及電腦科技追求之設計目標，而影響電子零組件品質及壽命的散熱問題如何同步突破解決，儼然成為主要的關鍵技術。
鋁合金散熱器（Heat Sink）目前雖為提供電子元件最簡易且直接散熱的方式，當中央處理器（CPU）的工作頻率高達1G以上、發熱功率超過50W時選用銅製散熱器則較鋁合金優勢，而以純銅製又因其比重大、成本高而提高了3C產品之重量及成本。因此本實驗採以結合純銅及鋁合金結合，且以不添加填料或助銲劑方式進行鋁/銅複合接合之技術開發與研究。
接合完成的試件，分別利用SEM、EDX、XRD、EPMA觀察和分析接合界面及剪力試驗破斷面，機械性質方面則藉由MTS拉伸試驗機及維氏微硬度機，分析評估剪力強度值及接合界面硬度分佈的變化。
鋁銅液固擴散接合法在精確的溫度－時間控制下，形成共晶液相層反應，冷卻凝固後的擴散接合界面層內雖然形成AlCu、AlCuMg 等共晶化合物，造成熱傳導率的略微降低，但是比較於一般採用Sn-Ag填料之軟銲…等接合方法，鋁銅液固擴散接合的熱傳導率優異許多。同時其接合的剪力強度值可達到13Mpa以上，此一強度值可滿足在散熱元件的應用需求。 | zh_TW |
| dc.description.abstract | ABSTRACT
Both electric and relation technology industrial develop fast in these years. The product design technology in addition to ask more and more the material with light weightiness, high specific strength and excellent heat scattering, the latest electric and computer design purpose emphasized increase calculate speed and effectiveness as well. It’s clearer that high temperature of radiator is key factor cause life and quality to debase. Thus, how to find out one giant solution to reduce temperature of radiator in the meanwhile is very important.
The Al alloy radiator can provide electric elements one simple and direct cooling method. Supposing CPU work frequency increase upon 1G bites simultaneously bring about a lot heat over 500W, Cu alloy is more better excellent than Al alloy. The property of pure Cu has high specific weight and high cost which easily raise product weight and cost. Thus, an experiment integrated Al alloy and Cu alloy, in the meantime without offer filler or flux during welding process on Al-Cu compound joint technology development and research.
The welded specimen utilize SEM, EDX, XRD, EPMA instrument to observe and analysis joint interface and fracture area passes through
shear test respectively. Depend on the MTS equipment and micro-hardness instrument evaluation shear strength value and micro-hardness value distribution on joint interface respectively.
The Al-Cu liquid-solid diffusion joint method based on precise temperature and time, create eutectic-liquid reaction lever. The cooled eutectic-liquid reaction lever formation existence eutectic compound like AlCu, AlCuMg which cause heat conduction to lower slightly, nevertheless, it’s still excellent than other method which add Sn-Ag filler during welding. Thus, the Al-Cu liquid-solid diffusion joint method has much heat conduction ability. It’s shear strength value on joint locate exceed 13Mpa. This value suffice certainty for apply to radiator. | en_US |
| DC.subject | 硬銲 | zh_TW |
| DC.subject | 散熱器 | zh_TW |
| DC.subject | 液固擴散接合 | zh_TW |
| DC.subject | 銅合金 | zh_TW |
| DC.subject | 鋁合金 | zh_TW |
| DC.subject | 軟銲 | zh_TW |
| DC.subject | Al alloy | en_US |
| DC.subject | Cu alloy | en_US |
| DC.subject | Soldering | en_US |
| DC.subject | Brazing | en_US |
| DC.subject | Heat Sink | en_US |
| DC.subject | liquid phase diffusion bonding | en_US |
| DC.title | 鋁/銅液相擴散接合研究與應用 | zh_TW |
| dc.language.iso | zh-TW | zh-TW |
| DC.title | Study and application Al/Cu liquid phase diffusion bonding | en_US |
| DC.type | 博碩士論文 | zh_TW |
| DC.type | thesis | en_US |
| DC.publisher | National Central University | en_US |