dc.description.abstract | The study object is to investigate and establish the technology competitive stategy for CPU cooling systems. As the successfully continuous development of semiconductor process and the extended requirement of the multi-function performances of PC, the CPU speed and the consuming power are increased obviously. The increased power results in the rising of the temperature in PC and the harmful effects upon the semiconductor‘s operations. Recently, the conventional copper/aluminum cooler is confronting the difficulty of efficiently dissipating enough heat from high-power PC in a cramped space. The heat dissipation technology is an important index for the performance and life-span of the newly issued CPUs. The beginning of the study is to analyze and classify several conventional and new cooling technologies into four types which are the fin cooler, the micro heat-pipe module, the vapor chamber cooling system, and the micro cooler. Basic SWOT analyses and the questionnaire have been completed after the investigation of the external network key factors and the internal strength-weakness factors. Refined SWOT analyses are then accomplished to generate strategies for SO, WO, ST, and WT combinations. Combined strategies are categorized into five competitive-advantage strategies which are of innovation, defense, improvement, follower, and opportunist. The outcome of the study provides the framework of the technological development strategy for those enterprises providing cooling solutions of CPU to establish their specific technology roadmaps. | en_US |