| DC 欄位 |
值 |
語言 |
| DC.contributor | 機械工程學系 | zh_TW |
| DC.creator | 吳瑋榤 | zh_TW |
| DC.creator | Wei-Chieh Wu | en_US |
| dc.date.accessioned | 2006-7-14T07:39:07Z | |
| dc.date.available | 2006-7-14T07:39:07Z | |
| dc.date.issued | 2006 | |
| dc.identifier.uri | http://ir.lib.ncu.edu.tw:88/thesis/view_etd.asp?URN=93323030 | |
| dc.contributor.department | 機械工程學系 | zh_TW |
| DC.description | 國立中央大學 | zh_TW |
| DC.description | National Central University | en_US |
| dc.description.abstract | 摘要
在微細加工的領域中，放電加工能夠加工直徑小於100μm的孔徑，但易產生放電坑、再鑄層與微裂痕，因此加工後的孔徑與粗糙度不盡理想，嚴重影響微孔的表面品質，而本研究為了改善放電加工所產生的缺點，擬開發利用複合電鍍沉積方式製作微研磨工具，並以高鎳合金為工件材料，期能將放電加工後的微細孔洞進行孔壁研磨加工，而獲得高精度且低粗糙度的精微孔洞，以作為精密工業之用。
實驗結果顯示，以電流為10mA、陽極環孔徑為5mm、磨粒粒徑為4μm、轉速為15rpm、磨粒添加量為10g/L與CTAB界面活性劑為150ppm等參數進行複合電鍍沉積微型研磨工具，並再以進給速度30μm/min對放電過後的微孔進行研磨加工時，可得到較光滑平整的微孔孔壁，孔壁表面粗糙度值由1.47μm Rmax (0.2μm Ra)降至0.462μm Rmax (0.026μm Ra)。 | zh_TW |
| dc.description.abstract | Abstract
This study presents a novel process of using micro-electro-discharge-machining (micro-EDM) combined with electro-codeposition to fabricate the micro-grinding-tool to machining a micro-hole on high nickel alloy. During the machining process, a micro-grinding-tool is fabricated by wire electro-discharge grinding (WEDG) and electro-codeposition directly by using micro-EDM for machining the micro-hole and by micro-grinding to finish the hole wall.
The experimental result shows the suitable parameters obtained to fabricating micro-grinding-tool for electro-codeposition are considered to be the following: electric current of 10 mA, hole diameter of positive ring is 5 mm, SiC particle size of 4μm, SiC particle concentration of 10 g/L, rotational speed of 15 rpm and CTAB of 150 ppm. By this method, The micro-grinding-tool will provided with smoothness surface on coating layer, uniform particle distribution and suitable adhesion particle quantity. Finally, the tool feed adopts as 30 μm/min in micro-grinding process, the surface roughness reduces from 1.47 μm Rmax (0.2 μm Ra) to 0.462 μm Rmax (0.026 μm Ra) after micro-grinding. | en_US |
| DC.subject | 微研磨加工 | zh_TW |
| DC.subject | 微型研磨工具 | zh_TW |
| DC.subject | 複合電鍍沉積 | zh_TW |
| DC.subject | 微孔 | zh_TW |
| DC.subject | 微放電加工 | zh_TW |
| DC.subject | Micro-hole | en_US |
| DC.subject | Micro-EDM | en_US |
| DC.subject | Micro-grinding | en_US |
| DC.subject | Electro-Codeposition | en_US |
| DC.subject | Micro-grinding-tool | en_US |
| DC.title | 結合微放電與複合電鍍沉積之精微加工研究 | zh_TW |
| dc.language.iso | zh-TW | zh-TW |
| DC.title | Micro Machining Using Micro-EDM Combined with Electro-codeposition | en_US |
| DC.type | 博碩士論文 | zh_TW |
| DC.type | thesis | en_US |
| DC.publisher | National Central University | en_US |