|dc.description.abstract||The present study deals with the operational efficiency of semiconductor foundry manufacturing units. This study is adopted 2001~2005 financial data of Taiwan Semiconductor Manufacturing Company’s (TSMC) fabs in Taiwan, which include two advanced twelve-inch wafer fabs, five eight-inch wafer fabs and one six-inch wafer fab. Basically, I apply Data Envelopment Analysis(DEA) method, by using CCR model to gain aggregate technical efficiency. Furthermore, I procure pure technical and scale efficiency through the use of BCC model. After that, I acquire the most suitable input under aggregate technical efficiency by applying slack variable analysis, and apply variable benchmark model to confer with the operational efficiency by using the advanced twelve-inch wafer fabs to be benchmark fabs to evaluate the eight-inch wafer fabs. Finally, I make use of Malmquist model to review the intertemporal efficiency index and Malmquist productivity index of each fab and observe if the efficiency would be different from various inch fabs. The study results will be an improvement reference of operational efficiency in TSMC fabs and further enable to maintain its highest competitiveness in semiconductor industry.
The result of my thesis finds the aggregate technical efficiency trend increased progressively from 2001 to 2005, and six-inch wafer and eight-inch wafer fabs can be as the benchmark fabs of twelve-inch wafer fabs. As for the aggregate technical efficiency and pure technical efficiency in TSMC’s fabs, there are some improvement areas for the input items of cost of good sold, fixed assets and inventories. In addition, if we use the advanced twelve-inch wafer fabs to be benchmark fabs to evaluate the eight-inch wafer fabs, it shows that eight-inch wafer fabs are more efficient than twelve-inch wafer fabs, that means TSMC should be more careful to invest its twelve-inch wafer fabs in the future.||en_US|