| dc.description.abstract | The object of this research about solder mask in PCB is that with the good developable property and resolution, To get the best condition for each solder mask, we study about solder mask process and compared the difference between AUS 320 and AUS 308, AUS 320 has wider and stable process window and a great resolution ,
developable property.
Study the mechanical properties by using fourier transform infrared spectroscopy, differential scanning calorimeter, thermogravimetric analyzer,dynamic mechanical analysis and scanning electron microscope.
AUS320 liquid photo imageable solder mask is halogen free material,we selected the dilution ratio,precure time,expose energy ,develop velocity and postcure condition as the control factors. From the result of tack dry, the performance of AUS 320 preheat has better tack comparison than AUS 308, there will be no roller mark after preheated for 38mins. Productivity is better than AUS 308. AUS 320 can apply on SM leveling, even that hardness is higher that AUS 308, it still has good leveling performance. The opening can get high resolution above the 80 μm, and the side wall is quite clean with no debris. The curing degree is higher than 97% by measuring with FTIR. | en_US |