博碩士論文 953901010 完整後設資料紀錄

DC 欄位	值	語言
DC.contributor	化學工程與材料工程學系	zh_TW
DC.creator	陳克明	zh_TW
DC.creator	Ker-Ming Chen	en_US
dc.date.accessioned	2008-7-21T07:39:07Z
dc.date.available	2008-7-21T07:39:07Z
dc.date.issued	2008
dc.identifier.uri	http://ir.lib.ncu.edu.tw:88/thesis/view_etd.asp?URN=953901010
dc.contributor.department	化學工程與材料工程學系	zh_TW
DC.description	國立中央大學	zh_TW
DC.description	National Central University	en_US
dc.description.abstract	本研究利用KrF準分子雷射（波長：248nm），對三種不同增層材料，進行雷射剝蝕鑽孔加工研究，求得各個的材料雷射加工特性：臨界起始能量密度、鑽孔蝕刻率、孔洞內之表面粗糙度，並且進行比對差異的分析研究。 在進行雷射鑽孔過程中，另外設計以加熱及冷卻方式，改變增層材料的雷射鑽孔環境溫度，藉此研究在不同環境溫度下，準分子雷射鑽孔加工之主要鑽孔機制為何？並觀察材料在不同溫度下進行鑽孔加工，是否會對其孔洞外觀、蝕刻率及表面粗糙度有所影響。	zh_TW
dc.description.abstract	This research uses KrF laser (the wave length: 248nm) on the build-up material of three different components, and drilling holes on them. The result we can get bulid-up material’’s threshold energy, and compare the etch rate, the hole’’s surface roughness to the difference analytical study. In carry on the laser drilling process, we design heating and cooling condition. To change the laser drilling temperature environment, and takes advantage of the research under the different ambient temperature, what is the main mechanism to KrF laser drilling process? And observes the material to carry on the drilling process under the different temperature, whether to its hole outward appearance、the etch rate and the surface roughness has the influence.	en_US
DC.subject	蝕刻率	zh_TW
DC.subject	準分子雷射	zh_TW
DC.subject	增層材料	zh_TW
DC.subject	表面粗糙度	zh_TW
DC.subject	etch rate	en_US
DC.subject	build-up material	en_US
DC.subject	roughness	en_US
DC.subject	Excimer laser	en_US
DC.title	準分子雷射在增層材料微鑽孔之研究	zh_TW
dc.language.iso	zh-TW	zh-TW
DC.title	Excimer Laser Ablation and Mircodrilling on Build-up Materials	en_US
DC.type	博碩士論文	zh_TW
DC.type	thesis	en_US
DC.publisher	National Central University	en_US