博碩士論文 962916016 完整後設資料紀錄

DC 欄位 語言
DC.contributor光電科學與工程學系zh_TW
DC.creator李佳祐zh_TW
DC.creatorChia-Yu Leeen_US
dc.date.accessioned2009-7-16T07:39:07Z
dc.date.available2009-7-16T07:39:07Z
dc.date.issued2009
dc.identifier.urihttp://ir.lib.ncu.edu.tw:88/thesis/view_etd.asp?URN=962916016
dc.contributor.department光電科學與工程學系zh_TW
DC.description國立中央大學zh_TW
DC.descriptionNational Central Universityen_US
dc.description.abstract本論文具體實現使用主動與被動光學元件整合至矽基微光學平台之光學連結技術,它可以作為板對板之光學連結應用。在架構上,矽基光連結發射端模組包含具單石化之矽基微45 度反射面、V型溝槽陣列、2.5 GHz高頻傳輸線、與金錫銲料,並利用混成構裝方式可利用被動對準之封裝技術,將面射型雷射、與多模態之光纖陣列以高精度的方式封裝整合。在1 × 1 cm2大小的發射端模組上具4 個信號傳輸通道,每通道速度可達2.5 Gbps;45 度微反射面深度為110 μm,其半導體製程誤差在6%之內;覆晶封裝製程之空間位移誤差於2 μm內,發射端模組之空間變異造成能量1 dB 損失時之光學準位容忍度為± 20 μm。光由面射型雷射發射經45 度微反射面後進入多模光纖的光耦合效率約為-6 dB,相鄰通道的串音雜訊準位在-50 dB以下。矽基光連結發射端模組在偏壓電流6 mA操作下,輸入2.5 Gbps (0.375Vp-p,PRBS 215-1)訊號之眼圖能通過OC-48 眼圖遮罩符合國際規範。 zh_TW
dc.description.abstractIn this thesis, an optical interconnect technology serving as a board to board interconnect is realized by assembling active and passive optical devices on a silicon-optical bench (SiOB). The transmitter module based on SiOB includes a monolithic integration of silicon-based 45° micro-reflector, V-groove arrays, high-frequency transmission lines of 2.5 GHz, and bonding pads with Au/Sn eutectic solder, as well as hybrid integration of VCSEL and fiber ribbon with compatibility to high precise passive alignment process. The size of transmitter module can be only 1 × 1 cm2 for the 4-channel interconnect. The depth of 45° micro-reflector reaches to 110 μm for providing -6 dB coupling efficiency from Vertical-Cavity Surface-Emitting Laser (VCSEL) to multi-mode fiber (MMF). Utilizing micro lithography and flip chip bonding processes, the process tolerance and VCSEL bonding accuracy are within 6 % and 2 μm, respectively, making sure the optical alignment tolerance within 20 μm and only 1 dB power variation. The performance of transmission lines of 2.5 GHz is experimentally demonstrated. The eye pattern was measured at circuit source 6 mA for 2.5Gbps PN-signal (15 bit). en_US
DC.subject被動對準式zh_TW
DC.subject微型化zh_TW
DC.subject4 通道zh_TW
DC.subject2.5 Gbpszh_TW
DC.subject光連結zh_TW
DC.subject發射端zh_TW
DC.subjectTransmitteren_US
DC.subjectPassive-Alignmenten_US
DC.subjectOptical Interconnect Moduleen_US
DC.title微型化被動對準式 4 通道 × 2.5 Gbps 光學連結模組之發射端研究zh_TW
dc.language.isozh-TWzh-TW
DC.titleResearch of Transmitting Part for Compact and Passive-Alignment 4-channel × 2.5 Gbps Optical Interconnect Moduleen_US
DC.type博碩士論文zh_TW
DC.typethesisen_US
DC.publisherNational Central Universityen_US

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