| dc.description.abstract | The thesis has designed a real time image guide continuity mode of
electroplating system, different with the intermittent mode of
electroplating. We use CCD to obtain image, and judge the distance
between micro-anode and the copper columns by image process, keep
this distance be a constant during the electroplating, finally improve the
structure character and surface appearance.
In the intermittent mode of electroplating process, the current
between two poles will change by their distance. It’’s easily to make the
structure character of micro-scale copper columns not uniform, and the
surface will not smooth.
Continuity mode of electroplating using the image process way, by
magnifier to control the gap, keep the gap inner a range made the electric
field will not change, the deposition will be more uniform, and the rate of
growth be a constant were help for getting uniform structure character
and smooth surface.
The thesis except using the image process and motor control on
electroplating, also combine the Entropy and Energy were two of the
statistics way to verify the result of judge the bubble at the image. And
discuss the most suitable color and the incidence direction with the light
source, to improve the reduce intensity of light when enlarge the image.
Complete the automatic judge the gap between two poles, and keep the
gap during the electroplating with micro-stepping motor, reach the gold
of continuity mode of electroplating. The result of experiment will show
the improved of the structure character and surface opposite the
intermittent mode of electroplating.
| en_US |