| dc.description.abstract | In this thesis, the compact and passive-alignment optical interconnect receiving module based on silicon optical bench (SiOB) is realized. The transmission speed of receiving modules are 4-channel × 5-Gbps and 4-channel × 10-Gbps, the former is corresponded to photo-detector (PD) which wavelength is 1310 nm, the later is corresponded to PD which wavelength is 850 nm. The size of module is 5 × 5 mm2. The receiving module can apply optical interconnect of board to board or chip to chip. The silicon-based optical interconnect receiving module includes a monolithic integration of 45° micro-reflector, V-groove arrays, high-frequency transmission lines of 10 GHz, bonding pads with Au/Sn eutectic solder and metal layer with high reflection coating (HR coating),using hybrid integration of PD and fibber array of 8 channels with passive alignment process. The 45° micro-reflector provides non-coplanar transmission, which surface roughness is less than 10 nm, etching depth is 110 um, V-groove arrays provide bench of setting fiber, the tolerance accuracy of fabrication process for SiOB is less than 6 %. The optical characteristic with receiving module, 1-dB tolerance of optical level of 850-nm and 1310-nm module are ±16 and ±20 um, respectively, responsivity are 0.5 and 0.7 A/W, respectively, the cross-talk between neighboring channels can be less than -25 dB. The frequency characteristic with receiving module, The eye pattern of 850-nm module and 1310-nm module can pass OC-192 and OC-96 eye mask, respectively. The bit error rate (BER) of them can achieve 10-11 order.
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