|dc.description.abstract||It’s had to come to maturity in micromechanics and microengineering, but the proportion of quartz wafer is less than silicon wafer in use. It’s gradually increasing the proportion of quartz wafer, cause the physical properties and characteristics of its materials better than others. It’s attaches great importance to isotropic etching and anisotropic etching of quartz, advances in technology make the size of various components is gradually shrinking. Etching is the most important process in MEMS and Semiconductor Manufacturing; through the spin coating we get the thin film and deposition, developed then wet(dry) etching the microstructure to get the microsensor, microtransducer in order to complete the semiconductor components.
We used a NH4HF2(ammonium bifluoride)saturated solution as an etchant in this paper and the etching temperature were selected with 55°C. The microstructure formation of image was take by SEM (scanning electron microscope), it can get more information about the anisotropic etching rate through various patterns in mask. It’s common to see the single cut of structure; otherwise we think about that use etching progress to get complex cut structure of quartz in this research, and the picking of crystal characteristic is the main point. The anisotropic etching which means that the etch rate is dependant on the crystal orientation, the structure development independently of the initial shape’s design of the etch mask. Experiments obtain more etch rate of specific crystal plane by observation two and three dimensional image of structure. Finally we can construct the database of etching rate for simulation the quartz structure, improve the defects to acquire the accurate etching data and forecast three dimensional structures. By etching get the special structure of quartz, and that these special surface structure. The mechanical, electronic, optical properties, to be in the future the application of quartz crystal have a broader application and integration.