| dc.description.abstract | In this study, a new system polishing wafer with abrasive of Al2O3 and daimond were studied, the system combined of bamboo charcoal and abrasive. The structure of bamboo charcoal existed many hollow tube, using the characteristic of large specific surface and porosities of bamboo charcoal to adsorption abrasive and through in the wafer surface by pressure. When manufacture start, the bamboo charcoal loading on the wafer surface, abrasive in bamboo charcoal will touch and wipe on wafer surface. At the same time, due to the structure of bamboo charcoal carrier itself is also disintegration by abrasive grinded, fractional abrasive in the hollow tube of bamboo charcoal are sustaining to the surface for processing.
In this experiment, we use the polishing machine (M-15FS) by JENG-YUEH ENTERPRISE CO.,LTD. with Self-clamping of vehicles of Bamboo Charcoal to studied the improve effect of polishing, and, analyzed and discussed results under different processing parameters. The experimental results obtained by the optimal parameters of different abrasive, in the appropriate load and speed, the particle size is 0.3μm alumina powder with deionized water 0.5wt%, it can be original silicon wafer surface roughness Ra 0.273μm to improve the surface roughness Ra 0.026μm, the sample surface up to the reflection of mirror effect, for 1μm particle size diamond powder, the surface roughness can be improved to Ra 0.021μm of mirror effect. The good effect on the wafer surface obtained by use of bamboo charcoal combined with abrasive polishing are proved.
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