博碩士論文 973303025 完整後設資料紀錄

DC 欄位	值	語言
DC.contributor	機械工程學系在職專班	zh_TW
DC.creator	林暘烈	zh_TW
DC.creator	Yang-Lie Lin	en_US
dc.date.accessioned	2011-1-21T07:39:07Z
dc.date.available	2011-1-21T07:39:07Z
dc.date.issued	2011
dc.identifier.uri	http://ir.lib.ncu.edu.tw:88/thesis/view_etd.asp?URN=973303025
dc.contributor.department	機械工程學系在職專班	zh_TW
DC.description	國立中央大學	zh_TW
DC.description	National Central University	en_US
dc.description.abstract	本研究目的在探討針測行程、次數、接觸力與針尖長度對晶圓針測用探針結構強度之影響，以期提供設計探針幾何參數之參考。研究內容運用田口方法的特點，規劃多項不同針測行程、接觸力及針尖長度組合之實驗，尋求影響探針強度的主要因素。另外，利用ABAQUS有限元素分析軟體，模擬不同實驗參數組合之探針應力分佈狀態，依據von Mises 降伏準則來判斷探針材料是否產生損壞，並與實際針測實驗之結果，進行比對分析，以暸解探針損壞現象及預測探針損壞條件。最後觀察在累積針測次數500及50,000次的條件下，產生探針結構損壞之不同針測行程、針尖長度及接觸力參數組合的條件。	zh_TW
dc.description.abstract	The purpose of this study is to investigate the effects of over-drive, number of probing test, contact force and probe tip length on the structural strength of probes for wafer test. Taguchi methods were applied to design the　experiments using probes with various combinations of over-drive, contact force and probe tip length so as to find out the key parameter in determining the structural strength of a probe. A commercial fine element analysis (FEA) code, ABAQUS, was employed to simulate the mechanical behavior of the probe during wafer testing with various combinations of probing parameters. The von Mises yield criterion was applied to asses whether a probe was failed based on the stress analysis results of FEA modeling. Another set of probing test was conducted to find out the proper combinations of probing parameters to survive 500 or 50,000 times of probing test.	en_US
DC.subject	有限元素分析	zh_TW
DC.subject	針測	zh_TW
DC.subject	探針卡	zh_TW
DC.subject	probe card	en_US
DC.subject	finite element analysis	en_US
DC.subject	Probing	en_US
DC.title	晶圓針測參數實驗與模擬分析	zh_TW
dc.language.iso	zh-TW	zh-TW
DC.title	Wafer probing analysis of the experiment and simulation parameters	en_US
DC.type	博碩士論文	zh_TW
DC.type	thesis	en_US
DC.publisher	National Central University	en_US