| dc.description.abstract | Wafer bonding is the core technology for semiconductor industry and related micro/nano devices. It has made significant innovation in recent years for its widely applications, such as silicon on insulator、high performance microelectronics、micro-electromechanical systems、3D IC and optoelectronics, etc. Today, as energy saving and carbon reduction is continuing to evolve, wafer bonding technology is needed to innovate for the green earth. Different bonding materials do not present difficulty for wafer bonding, but thermal mismatch imposes a severe limitation on the annealing temperature. The innovation needs of wafer bonding are high bonding strength、cost effective and energy saving. The aim of this study is to design a systematic evaluation index for wafer bonding technology based on thermal budget theory, and develop low temperature & high strength wafer bonding technology. The evaluation index include thermal budget ratio, energy efficiency and eco efficiency. The study also proposed an innovative wafer bonding technology, it was named “Green Wafer Bonding”, by hybrid HF-Dip and Nitrogen Plasma Activation methods. By the experiments, it can be proved green wafer bonding can provide high strength bonding in low temperature: Si/Si (2500mJ/cm2, 75oC) and Si3N4/Si3N4 (2500mJ/cm2, 200oC). By the evaluation, it showed Si/Si (RCA-HF-N2 Plasma) has the lowest thermal budget and energy efficiency is 51.6% and Si3N4/Si3N4 (RCA-HF-N2 Plasma) needs double thermal budget and energy efficiency is 28.6%. GWB technology has the best bonding quality and the highest enegy saving performace than the conventional bondig technologies. By the patent analysis, it showed the main application of wafer bonding are including MEMS, SOI and optoelectronics, etc. The study also applied GWB (Green Wafer Bonding) technology in smart-cut process and produced a nano-scaled Si film successfully. Green Wafer Bonding has many advantages, such as high bonding strength, low temperature, saving time and cost. The research can be applied for developing the energy saving semiconductor industry and new technologies, such as thermal-electricity converter, hydrogen storage and thin film solar cell, etc. | en_US |