dc.description.abstract | IC substrate is part of the IC industry supply chain, and also one of the important components which stands 30 to 50% of the total cost. The importance of IC substrate if to do connection between chip and PCB with the traces inside. Their main functions are trace protecting, trace location fixing, heat spreading, IC protection, and module standardization. The main characteristic is to do connection between the IC process and the assembly process. Because of the increasing function and the complexity of IC design, the importance of the IC substrate also increased. The IC’s function can be fully unleashed only under a good substrate and a precise assembly process.
As the technology improved day by day, and the popularizing of portable electronic devices, our daily life becomes closely related to those electronic products. Because we need to know if one electronic device can be well function in certain period of time, the reliability tests need to be applied. Usually a device needs one or three years for the reliability tests, but considering in business aspect, this is unacceptable. We need to do stimulating tests to speed up the test, so that the failure mode can be setup, and further more, to increase the reliability. All tests are judged under a simple rule: electrical failure, but the root cause of the failure might be various. Mechanical, chemical, radiation, and heat are the causes that we can evaluate the reliability.
Fractional factorial experiment mainly use in screening tests, where in the initial stage of the experiment, we use fractional factorial experiment to find the key factor, and then we focus on the key factor to do analysis.
As for the failure mode feedback through customer complaint, most of them are from the improper stress between IC substrate and PCB. This paper is focusing on the failure caused by IC substrate. Therefore the improvement is focusing on the reliability performance of electrical packaging, and the life increasing by stress improvement.
Except the solder ball type, reflow profile, the surface finish plating quality also plays an important role in the strength between solder ball and the pad. This research is to analyze the relationship between plating quality and the strength of solder ball and pad. Through proper DOE, we are able to find the best Ni plating parameter, so that the strength between solder ball and the pad can be improved.
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