| dc.description.abstract | Three-dimensional (3D) integration technology using through-silicon-via (TSV) has been widely acknowledged as one of future integrated circuit (IC) design technologies. 3D integration technology offers many benefits over 2D integration technology, such as high performance, low power, heterogeneous integration, small footprint, etc. However, many challenges should be overcome before volume production of TSV-based 3D ICs become possible, e.g., yield and test challenges, power and thermal challenges, infrastructure challenges, etc.
In this thesis, we propose memory architecture evaluation and exploration methods for 3D ICs. In the first part, an architecture and exploration tools for 3D random access memories (RAMs) is developed. The tool can estimate the performance, power consumption, footprint, yield, and cost for 3D RAMs architectures. Major difference between proposed tool and the existing, 3DCacti, tool is the capability of yield and cost estimation of a 3D RAMs. The designer can get a better 3D architecture which is met his requirement using the proposed tool. This can drastically shorten the design cycle of 3D RAMs.
In the second part, we propose an architecture evaluation and evaluation tool for 3D content addressable memories (CAMs). The CAM is much different from the RAM in architecture. For example, the CAM typical has a priority address encoder (PAE). Models of power, delay, and cost model for 3D CAMs are developed first. Then, the proposed tool can evaluate different 3D CAM architectures such that a better 3D CAM architecture can be obtained easily.
Finally, we propose a thermal-aware memory array architecture to alleviate the thermal problem in multi-core processor-memory stacked chips. Through thermal-aware remapping scheme, the peak temperature can be reduced. Two configuration types for thermal-aware remapping scheme are proposed. Experimental results show that it is possible to find a new configuration such that the peak temperature of the new configuration is lower than that of the original configuration.
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