| dc.description.abstract | In this thesis, transmitting part of optical interconnect module with three-dimensional optical Path is proposed. In this module, the laser and waveguide are on the different sides of SOI. The light is emitted from vertical cavity surface emitting laser (VCSEL). The light of laser passes through 500μm SOI and couples into ridge waveguide by 45 degree micro-reflector. By this way, the fabrication of electronic-device part and photonic-device part could be separated. The electronic-device, optical modulators, and waveguide could be combined. Therefore, photoelectric module could be highly density integrated and efficient energy. This module contains electronic-device layer and photonic-device layer. The high-frequency transmission line, VCSEL, and Au/Sn bonding pad are fabricated on the electronic-device layer. The 45 degree micro-reflector and trapezoidal ridge waveguide are fabricated on the photonic-device layer. Using the double-side alignment technology to combine the electronic-device layer and photonic-device layer on the SOI front and back sides.
To assess optical characteristic of optical connector, the multi-mode fiber is used to measure the optical level and degradation 1-dB tolerance of module in this research. The optical coupling is -8.09dB. The degradation 1-dB tolerances are 30μm and 19μm. Using low-resistivity SOI wafer (1 - 10 ohm-cm) to confirm the high frequency of this module and fabricate transmission line. This module in the operating speed of 2.5 Gbps, the rise and fall time is not much difference; eye signals in the eye margin (Eye margin) is very clean inside, and the eye height and eye width were 34 mV and 350 ps, thus, we can once again verify this module for the 2.5 Gbps signal transmission is a certain feasible.
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