博碩士論文 983207012 完整後設資料紀錄

DC 欄位	值	語言
DC.contributor	光機電工程研究所	zh_TW
DC.creator	陳建佑	zh_TW
DC.creator	Jian-You Chen	en_US
dc.date.accessioned	2011-11-14T07:39:07Z
dc.date.available	2011-11-14T07:39:07Z
dc.date.issued	2011
dc.identifier.uri	http://ir.lib.ncu.edu.tw:88/thesis/view_etd.asp?URN=983207012
dc.contributor.department	光機電工程研究所	zh_TW
DC.description	國立中央大學	zh_TW
DC.description	National Central University	en_US
dc.description.abstract	本論文提出一雷射掃描晶圓定位系統用來量測集束型設備中晶圓的 圓心位置。此定位系統是由雷射掃描系統與散射光偵測系統組成。利用振鏡 掃描器將雷射光線反射至感測區域形成一道掃描光線。當機械手臂輸送晶圓 通過掃描光線時，散射光偵測系統將接收到一光強度隨時間變化之散射光時 序訊號。根據散射光時序訊號與已知的速度及位置參數，晶圓位置演算法便 可計算出機械手臂運動速度與晶圓圓心位置。 為驗證系統之定位能力，使用四吋晶圓進行實驗。在以實驗速度為速度 參數之實驗中，定位精確度小於1.5mm；在以理論速度為速度參數之實驗中 ，定位精確度則皆小於0.1mm。本系統亦可用於速度量測，速度量測之絕對 誤差小於1mm/s，量測精確度則低於0.7mm/s。	zh_TW
dc.description.abstract	A laser scanning method for wafer positioning is proposeed to determine the center position of the wafer in the cluster tool. This positioning system incorporates a laser scanning system and a scattering light receiving system. The scanner is used to reflect a laser beam into a scanning line on the sensing area. As the wafer passes by the scanning line, a scattering light receiving system detects the time-sequence signal of the scattered lights. The velocity of a robot plate and the position of wafer ia determined by signal processing of the time-sequence signal. 4-inch wafer positioning experiment results demonstrate that the positioning system can be used to detectc the positioning of a wafer. The velocity measurement precision is under 0.7 mm/s, and the absolut error is about 1 mm/s. The wafer positioning precision is 0.1 mm.	en_US
DC.subject	晶圓定位	zh_TW
DC.subject	雷射掃描	zh_TW
DC.subject	散射光時序訊號	zh_TW
DC.subject	Scattering Light Signal	en_US
DC.subject	Wafer Positioning	en_US
DC.subject	Laser Scanning Method	en_US
DC.title	雷射掃描晶圓定位系統	zh_TW
dc.language.iso	zh-TW	zh-TW
DC.title	Wafer Positioning by Laser Scanning Method	en_US
DC.type	博碩士論文	zh_TW
DC.type	thesis	en_US
DC.publisher	National Central University	en_US