| dc.description.abstract | Abstract
Many innovative products have been manufactured by modern technologies soldering process,acting as a key technology in the manufacturing process faces a new challenges ,since the strick requirement on the quality of solder joint. Among the soldering technologies, wave soldering process is adopted a popular methods in the industy . The use of Pb-Free solders in place of Pb-Sn solders inclined to modify the operational conditions in the soldering process , wave soldering of factors impactis is quite many factors,including improper design,roughness of drilling hole size on the board ,moisture PCB content in the storage components, improper clearance between the size and the aperture of the holes, non-uniform deposit in the through-holes and pins of coated with various thickness of oxides etc,haved been found to affect the performance of soldering. In this dissertation, the author try to investigate the optimization of the lead-free wave soldering process to have been found to means of the technique by design of experiments method. The purpose of this work is to find out the most important factors in the wave soldering process dominating the solder quality .As a result optimal parameters were selected following by using of design of experiments to rule out many possible soldering defect. For examples the clearance at various levels should be set to a blance value between the pin size and the hole size on the board. A greater clearance is necessary a between the pin and hole when a bent pin need to be plugged in the hole, the humidity and temperature of processing environment should be strictly controlled in order to ensure the quality and stability of the solders,there is a good consistent between the experimental result of wave-soldering process performed under the optimal conditions selected by means of design of experiments and the theorectical results predicted according to design of experiments .This consistence implied that design of experiments is an applicable technique suitable for quality control in wave-soldering process. | en_US |